The **ATS-07G-28-C2-R0** is a specific electronic component, categorized as a **High-Performance Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their *blueICE*™ series, designed primarily for cooling BGA (Ball Grid Array) components and other surface-mount devices. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 40.00 mm x 40.00 mm | | **Height (Height off Base)** | 17.78 mm | | **Thermal Resistance** | 10.57°C/W (Natural) / 1.50°C/W (Forced Air @ 200 LFM) | | **Attachment Method** | pushPIN™ | | **Flow Orientation** | Vertical / Top Down | --- ### 2. Core Electronic/Thermal Features * **pushPIN™ Attachment:** This model uses a spring-loaded pin mechanism to provide high-pressure attachment to the PCB. This ensures maximum thermal contact between the heat sink and the electronic component (CPU, GPU, or FPGA). * **Thermal Interface Material (TIM):** Typically, this specific part comes pre-applied with **T766** (a high-performance thermal grease) or is compatible with standard thermal pads to fill the microscopic air gaps between the chip and the metal. * **Fin Design:** It utilizes a **Cross-Cut** fin pattern. Unlike straight fins, cross-cut fins allow for airflow from multiple directions, making it more efficient in systems where the direction of the cooling fan may not be perfectly aligned with the heat sink. * **Blue Anodized Finish:** Beyond aesthetics, the anodization protects the aluminum from corrosion and slightly increases surface emissivity, which helps in radiant heat transfer. --- ### 3. Application Use Cases This part is commonly found in the following electronic assemblies: 1. **Network Switches/Routers:** Cooling high-speed processing chips. 2. **Power Supplies:** Managing heat for MOSFETs or power regulators. 3. **Industrial PCs:** Providing passive or active cooling in cramped enclosures. 4. **Embedded Systems:** Specifically for BGA packages that generate between 5W and 15W of heat. ---