ATS-07G-31-C2-R0
AI

The **ATS-07G-31-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It is part of their "push pin" attachment series, commonly used for cooling processors, chipsets, and other surface-mount components.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of the part:
| Characteristic | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Dimensions (L x W x H)** | 57.90mm x 36.83mm x 5.84mm |
| **Thermal Resistance** | 25.25° C/W (Natural Convection) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
| **Fin Type** | Straight Fin |
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### 2. Electronic Application & Usage
This part is not an "active" electronic component (like a transistor) but a "passive" mechanical component essential for electronic reliability.
* **Heat Dissipation:** It increases the surface area of a heat-generating component (like a BGA or FPGA), allowing the surrounding air to carry heat away more efficiently.
* **Thermal Interface:** The unit comes with **T766** pre-applied. This is a phase-change material that fills microscopic air gaps between the chip surface and the heatsink to maximize heat transfer.
* **Attachment Logic:** The "Push-Pin" design uses a spring-loaded mechanism. This ensures constant pressure on the electronic package, which prevents the heatsink from shifting during vibration or thermal expansion.
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### 3. Airflow Performance Data
The effectiveness of this heatsink changes based on the air velocity (LFM - Linear Feet per Minute) inside the electronic enclosure:
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| **200 (1.0 m/s)** | 6.03 |
| **400 (2.0 m/s)** | 3.66 |
| **600 (3.0 m/s)** | 2.87 |
| **800 (4.0 m/s)** | 2.48 |
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### 4. Key Component Features
* **Low Profile:** At only 5.84mm height, it is ideal for high-density electronic assemblies (1U servers or thin client devices).
* **Pre-Drilled Holes:** Designed specifically for PCB layouts with a hole pitch of **47.24mm**.
* **Durability:** The blue anodized finish provides corrosion resistance and increased surface emissivity.
- ⤷What is the difference between T766 and other thermal interface materials?
- ⤷ How do I calculate if this heatsink is sufficient for my chip's TDP?
- ⤷ Are there alternative attachment methods if my PCB doesn't have holes?