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  • ATS-07G-31-C2-R0

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    The **ATS-07G-31-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It is part of their "push pin" attachment series, commonly used for cooling processors, chipsets, and other surface-mount components. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 57.90mm x 36.83mm x 5.84mm | | **Thermal Resistance** | 25.25° C/W (Natural Convection) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Fin Type** | Straight Fin | --- ### 2. Electronic Application & Usage This part is not an "active" electronic component (like a transistor) but a "passive" mechanical component essential for electronic reliability. * **Heat Dissipation:** It increases the surface area of a heat-generating component (like a BGA or FPGA), allowing the surrounding air to carry heat away more efficiently. * **Thermal Interface:** The unit comes with **T766** pre-applied. This is a phase-change material that fills microscopic air gaps between the chip surface and the heatsink to maximize heat transfer. * **Attachment Logic:** The "Push-Pin" design uses a spring-loaded mechanism. This ensures constant pressure on the electronic package, which prevents the heatsink from shifting during vibration or thermal expansion. --- ### 3. Airflow Performance Data The effectiveness of this heatsink changes based on the air velocity (LFM - Linear Feet per Minute) inside the electronic enclosure: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 6.03 | | **400 (2.0 m/s)** | 3.66 | | **600 (3.0 m/s)** | 2.87 | | **800 (4.0 m/s)** | 2.48 | --- ### 4. Key Component Features * **Low Profile:** At only 5.84mm height, it is ideal for high-density electronic assemblies (1U servers or thin client devices). * **Pre-Drilled Holes:** Designed specifically for PCB layouts with a hole pitch of **47.24mm**. * **Durability:** The blue anodized finish provides corrosion resistance and increased surface emissivity.
    ✨ Follow-up Questions
    • ⤷What is the difference between T766 and other thermal interface materials?
    • ⤷ How do I calculate if this heatsink is sufficient for my chip's TDP?
    • ⤷ Are there alternative attachment methods if my PCB doesn't have holes?