The **ATS-07G-34-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 35.00mm | | **Thermal Resistance** | 6.73°C/W (Unducted Flow @ 100 LFM) | | **Fin Style** | Straight Fin | --- ### 2. Component Analysis #### A. Thermal Design The "34" in the part number indicates a height of **35mm**. This is a relatively tall heat sink for its footprint, providing a large surface area for heat exchange. The **straight fin** design is optimized for forced-air cooling environments where airflow is directed through the fins. #### B. Mounting System (pushPIN™) The part utilizes the proprietary **pushPIN™** attachment mechanism. This system includes: * **Flexible Springs:** Provide precise pressure (Pre-assembled) to ensure optimal thermal interface contact. * **Brass/Plastic Pins:** Secure the heat sink directly to pre-drilled holes in the PCB. * **Ease of Assembly:** Designed for quick installation without complex tools. #### C. Material and Coating * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Finish:** This is not just aesthetic; anodizing improves the emissivity of the surface (increasing radiant heat transfer) and provides corrosion resistance. --- ### 3. Application Use Cases This specific heat sink is typically found in: 1. **Telecommunications:** Cooling signal processing chips in base stations. 2. **Embedded Systems:** Cooling industrial PCs or high-end microcontrollers. 3. **Power Electronics:** Managing heat for VRMs (Voltage Regulator Modules) or power MOSFETs. ---