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  • ATS-07G-38-C2-R0

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    The **ATS-07G-38-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions Inc.* It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The following table outlines the key physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 22.86mm | | **Thermal Resistance** | 6.42°C/W (Unducted Flow @ 100 LFM) | | **Fin Style** | Straight Fin | --- ### 2. Key Electronic Functions In an electronic circuit or system, this part serves several critical roles: * **Thermal Dissipation:** It increases the surface area of a heat-generating component, allowing heat to transfer into the ambient air more efficiently via convection. * **Structural Integrity:** The use of a **Push-Pin** mounting system ensures a consistent and reliable pressure (Pre-load) across the thermal interface material (TIM), which is vital for electrical efficiency and heat transfer. * **Protection:** By maintaining a lower junction temperature ($T_j$), it extends the Mean Time Between Failures (MTBF) of the semiconductor it is attached to. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying the specific configuration: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer Prefix (Advanced Thermal Solutions) | | **07** | Series Identifier (pushPIN™ type) | | **G** | Material/Process Code | | **38** | Dimension Code (Width/Length) | | **C2** | Thermal Performance/Height Category | | **R0** | RoHS Compliant / Revision Status | --- ### 4. Integration Considerations When integrating the ATS-07G-38-C2-R0 into a PCB design, engineers must consider: 1. **Clearance:** Ensure the 36.83mm footprint does not interfere with nearby capacitors or inductors. 2. **Airflow Direction:** As a straight-fin heat sink, it is most effective when the airflow is parallel to the fins. 3. **TIM Selection:** While the part often comes with pre-applied Thermal Interface Material (T412), high-power applications may require specific thermal greases.
    ✨ Follow-up Questions
    • ⤷ What are the benefits of using a Push-Pin mounting system over adhesive tapes?
    • ⤷ How does the 'Blue Anodized' finish affect the thermal performance?
    • ⤷ What is the recommended airflow (LFM) for optimal cooling with this heat sink?