The **ATS-07G-55-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Mounting Type** | pushPIN™ | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 10.00mm | | **Thermal Resistance (Flowing)** | 4.84 °C/W @ 100 LFM | | **Thermal Resistance (Unducted)** | 23.98 °C/W | | **Attachment Method** | Plastic Push Pin | --- ### 2. Key Components & Design Features #### A. pushPIN™ Attachment System This part features a specialized mounting system designed for high reliability and ease of installation. It includes: * **Plastic Push Pins:** Used to secure the heat sink to the PCB (Printed Circuit Board) via pre-drilled holes. * **Compression Springs:** Provides consistent pressure (Force) across the interface between the component and the heat sink, ensuring optimal heat transfer. #### B. Fin Design The "G" in the part number often refers to the **straight-fin** or **cross-cut** profile. This specific model uses a high-density fin arrangement to maximize surface area within a small 35mm footprint. #### C. Thermal Interface Material (TIM) The "R0" suffix usually indicates that the part comes with a pre-applied thermal interface material (like a phase-change pad or thermal grease). This eliminates the need for manual application during assembly. --- ### 3. Part Number Breakdown The part number follows a specific nomenclature used by ATS: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **07** | Product Series / Type | | **G** | Fin Profile / Material Grade | | **55** | Specific Design Dimension / ID | | **C2** | Performance / Material Grade (Aluminum with Blue Anodized finish) | | **R0** | Packaging / Revision (includes TIM) | --- ### 4. Typical Applications * **Embedded Systems:** Cooling small-form-factor processors. * **Telecommunications:** Dissipating heat from networking chips. * **Power Supplies:** Cooling voltage regulators or MOSFETs.