The **ATS-07G-62-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the "push-pin" series designed for secure attachment to printed circuit boards (PCBs). --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | Push-Pin (Plastic) | | **Heat Sink Type** | Straight Fin | | **Thermal Resistance** | 1.64°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic Components Breakdown #### A. The Heat Sink Body The body is constructed from **Aluminum 6063**, which is preferred in electronics for its excellent thermal conductivity and lightweight properties. The **Straight Fin** geometry is optimized for high-density airflow environments (forced convection), allowing heat to dissipate from the component to the ambient air. #### B. The Push-Pin Attachment Mechanism Instead of using messy adhesives or permanent solder, this part uses a **plastic push-pin** with a brass spring. * **Purpose:** Provides consistent pressure (clamping force) on the electronic chip. * **Benefit:** Ensures maximum surface contact between the chip and the heat sink, reducing thermal impedance. #### C. Thermal Interface Material (TIM) The base of the ATS-07G-62-C2-R0 comes with **T766** pre-applied. * **Role:** Fills microscopic air gaps between the heat sink and the electronic component (CPU, GPU, or FPGA). * **Performance:** T766 is a high-performance phase-change material that ensures efficient heat transfer. --- ### 3. Common Applications This part is typically used to cool mid-range electronic components that generate significant heat during operation: 1. **Network Switches & Routers:** Cooling ASICs and processing units. 2. **Industrial PCs:** Thermal management for embedded processors. 3. **Power Supplies:** Heat dissipation for MOSFETs or power regulators. 4. **FPGA Boards:** Cooling high-speed programmable logic gates. --- ### 4. Thermal Performance Comparison Thermal resistance indicates how effectively the part moves heat away (lower is better). | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low) | 6.46 | | 200 (Medium) | 1.64 | | 400 (High) | 1.17 |