The **ATS-07G-66-C2-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**, manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ## 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-07G-66-C2-R0 | | **Type** | Board Level Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 5.77°C/W (Unducted Flow @ 100 LFM) | | **Dimensions** | 45mm x 45mm x 25mm | --- ## 2. Key Physical Components ### A. The Heat Sink Body The body is constructed from **Aluminum**. Aluminum is chosen for its excellent thermal conductivity-to-weight ratio. The "Blue Anodized" coating is not just for aesthetics; it provides surface protection against corrosion and slightly increases emissivity for better radiation heat transfer. ### B. Fin Design This part typically features a **Straight Fin** or **Cross-Cut** design (depending on the specific revision). These fins increase the surface area available to dissipate heat into the surrounding air through convection. ### C. Attachment Mechanism (Push-Pins) The "R0" suffix indicates a specific hardware kit. The assembly uses: * **Brass Push-Pins:** These provide a secure, standardized mechanical connection to the PCB. * **Compression Springs:** These ensure consistent pressure (clamping force) between the heat sink and the electronic component, which is vital for thermal efficiency. ### D. Thermal Interface Material (TIM) Most "C2" variants come pre-applied with a high-performance **Phase Change Material (PCM)** or thermal tape. This fills the microscopic air gaps between the component and the heat sink base to maximize heat transfer. --- ## 3. Performance Breakdown The thermal resistance of this part varies based on the airflow velocity (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural) | 5.77 | | 200 (Forced) | 2.36 | | 300 (Forced) | 1.84 | --- ## 4. Typical Applications * **Integrated Circuits (ICs):** Cooling FPGAs and ASICs. * **Telecommunications:** Used on high-speed networking line cards. * **Industrial Power:** Managing heat on power supply modules.