The **ATS-07G-67-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **blueICE™** series and is designed for cooling electronic components such as CPUs, GPUs, and power modules. --- ### 1. Technical Specifications The following table highlights the physical and thermal properties of the part: | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 12.03°C/W (at 100 LFM) | | **Fin Type** | Straight Fin | --- ### 2. Design Characteristics This component is engineered for efficient heat dissipation in confined spaces: * **pushPIN™ Attachment:** This system includes a flexible, tool-free mounting mechanism. It uses a stainless steel spring to provide precise pressure for maximum thermal interface contact. * **Blue Anodized Coating:** This is not just aesthetic; the anodization increases surface emissivity, slightly improving radiation heat transfer and protecting the aluminum from corrosion. * **Thermal Interface Material (TIM):** The part typically comes with **T412** thermal tape or pre-applied grease to bridge the microscopic air gaps between the heat sink and the electronic chip. --- ### 3. Thermal Performance Profile Thermal resistance is dependent on the airflow (velocity) within the electronic enclosure. | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 12.03 | | 200 (1.0 m/s) | 4.42 | | 300 (1.5 m/s) | 3.12 | | 400 (2.0 m/s) | 2.50 | --- ### 4. Common Applications * **FPGA & ASIC Cooling:** Used in networking hardware where high-speed chips generate significant heat. * **Embedded Systems:** Ideal for industrial PCs where vertical clearance (10mm height) is limited. * **Power Supplies:** Cooling of MOSFETs or voltage regulators in DC-DC converters.