The **ATS-07G-68-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series designed for thermal management of electronic components like CPUs, GPUs, and other high-heat-generating ICs. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 15mm | | **Pitch (Pattern)** | Fine Pitch | | **Thermal Resistance** | 15.31 °C/W (Unducted Flow @ 100 LFM) | --- ### Key Electronic & Mechanical Components #### 1. Heat Sink Body (Thermal Dissipater) The core of the unit is an aluminum extrusion. The **"Fine Pitch"** fin design maximizes surface area within a compact 15mm height, allowing it to dissipate heat into the ambient air via convection. #### 2. Push-Pin Attachment Instead of using messy adhesives or permanent solder, this part uses a mechanical **push-pin** system. * **Pins:** Typically made of brass or plastic. * **Springs:** Provides consistent "Pre-load" pressure, ensuring the flat bottom of the heat sink stays in constant contact with the electronic chip. #### 3. Thermal Interface Material (TIM) The part usually comes with **T766** pre-applied. This is a specialized material that fills microscopic air gaps between the heat sink and the component, significantly lowering thermal resistance. --- ### Performance Overview The efficiency of this heat sink depends on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (Ducted) | | :--- | :--- | :--- | | 100 | 0.5 | 15.31 °C/W | | 400 | 2.0 | 2.33 °C/W | | 700 | 3.5 | 1.60 °C/W | --- ### Common Applications * **BGA Components:** Large Grid Array chips found on motherboards. * **Power Supplies:** Cooling voltage regulators. * **Telecommunications:** Used in routers and switches where vertical space is restricted to 15mm.