The **ATS-07G-69-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of their "pushPIN™" series, designed for cooling integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Specification | Detail | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Type** | Push Pin (Spring-loaded) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height (Fin)** | 20mm | | **Thermal Resistance** | 11.56° C/W (Natural Convection) | | **Airflow Path** | Straight (Open Fin) | --- ### 2. Key Design Components #### A. The Fin Profile This model uses **Straight Fins**. - Straight fins provide low pressure drop and are ideal for systems where airflow is directed linearly across the board. - The 20mm height allows for a significant surface area for heat dissipation without being too tall for standard 1U or 2U enclosures. #### B. Attachment Mechanism: pushPIN™ Unlike adhesive-based heat sinks, the "pushPIN" system ensures consistent pressure. * **Compression Springs:** Provide a precise amount of force to ensure the thermal interface material (TIM) makes optimal contact with the chip. * **Plastic/Brass Pins:** Secure the heat sink to the PCB through pre-drilled holes, preventing the component from shifting due to vibration or thermal expansion. #### C. Material and Coating * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Finish:** This is not just aesthetic; anodizing increases surface emissivity and provides corrosion resistance. --- ### 3. Thermal Performance Data Performance varies based on the velocity of the air (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 11.56 | | 300 (1.5 m/s) | 2.53 | | 500 (2.5 m/s) | 1.58 | | 700 (3.5 m/s) | 1.23 | --- ### 4. Implementation Considerations 1. **PCB Layout:** You must have the correct hole pattern on your PCB to accommodate the push pins. The hole-to-hole distance for this 45mm sink is typically defined in the ATS datasheet. 2. **TIM (Thermal Interface Material):** This part usually comes with a pre-applied Phase Change Material or high-performance thermal pad on the base to bridge the microscopic gaps between the heat sink and the electronic component. ---