ATS-07G-79-C3-R0
AI

The **ATS-07G-79-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the "push pin" series designed for securing the cooler directly to a Printed Circuit Board (PCB).
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## Technical Specifications
The following table outlines the physical and thermal properties of this specific model:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Dimensions (L x W)** | 25mm x 25mm |
| **Height** | 30mm |
| **Attachment Type** | Push-Pin (Brass) |
| **Spring Type** | Compression Spring |
| **Thermal Resistance** | 2.68°C/W (at 200 LFM) |
| **Thermal Interface Material (TIM)** | T412 (Double-sided adhesive tape) |
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## Component Breakdown
### 1. The Heat Sink Body
The device utilizes a **Straight Fin** design. This geometry is optimized for "longitudinal" airflow, where the air moves through the channels between the fins. The use of Aluminum 6063 provides a balance between lightweight construction and high thermal conductivity.
### 2. The Mounting System (Push-Pin)
Unlike "clip-on" or "glue-on" heat sinks, the **ATS-07G-79-C3-R0** uses a mechanical push-pin mechanism:
* **Brass Pins:** Provide a durable, reusable attachment point.
* **Springs:** Ensure constant, uniform pressure across the electronic component (CPU, FPGA, or MOSFET), which is critical for maximizing heat transfer to the sink.
### 3. Thermal Interface Material (TIM)
The "C3" in the part number indicates the specific thermal tape applied to the base. In this case, it is **T412**, which provides:
* High thermal conductivity.
* Strong adhesion to the component surface.
* Elimination of microscopic air gaps between the heat source and the sink.
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## Applications in Electronics
This part is typically used to cool small-form-factor high-heat components such as:
* **Integrated Circuits (ICs):** Such as voltage regulators or motor drivers.
* **Networking Gear:** Cooling chips in routers or switches.
* **Embedded Systems:** Industrial PCs where space is limited but vertical height (30mm) is available.
- ⤷
What are the differences between straight fin and cross-cut fin heat sinks?
- ⤷ How does 'LFM' (Linear Feet per Minute) impact the thermal resistance of this part?
- ⤷ Are there specific PCB hole diameter requirements for the brass push-pins?