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  • ATS-07G-79-C3-R0

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    The **ATS-07G-79-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the "push pin" series designed for securing the cooler directly to a Printed Circuit Board (PCB). --- ## Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 25mm x 25mm | | **Height** | 30mm | | **Attachment Type** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 2.68°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T412 (Double-sided adhesive tape) | --- ## Component Breakdown ### 1. The Heat Sink Body The device utilizes a **Straight Fin** design. This geometry is optimized for "longitudinal" airflow, where the air moves through the channels between the fins. The use of Aluminum 6063 provides a balance between lightweight construction and high thermal conductivity. ### 2. The Mounting System (Push-Pin) Unlike "clip-on" or "glue-on" heat sinks, the **ATS-07G-79-C3-R0** uses a mechanical push-pin mechanism: * **Brass Pins:** Provide a durable, reusable attachment point. * **Springs:** Ensure constant, uniform pressure across the electronic component (CPU, FPGA, or MOSFET), which is critical for maximizing heat transfer to the sink. ### 3. Thermal Interface Material (TIM) The "C3" in the part number indicates the specific thermal tape applied to the base. In this case, it is **T412**, which provides: * High thermal conductivity. * Strong adhesion to the component surface. * Elimination of microscopic air gaps between the heat source and the sink. --- ## Applications in Electronics This part is typically used to cool small-form-factor high-heat components such as: * **Integrated Circuits (ICs):** Such as voltage regulators or motor drivers. * **Networking Gear:** Cooling chips in routers or switches. * **Embedded Systems:** Industrial PCs where space is limited but vertical height (30mm) is available.
    ✨ Follow-up Questions
    • ⤷ What are the differences between straight fin and cross-cut fin heat sinks?
    • ⤷ How does 'LFM' (Linear Feet per Minute) impact the thermal resistance of this part?
    • ⤷ Are there specific PCB hole diameter requirements for the brass push-pins?