The **ATS-07G-82-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications Below are the primary technical parameters for this specific part number: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance (Flowing)** | 2.49 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 10.79 °C/W | | **Dimensions (L x W x H)** | 30mm x 30mm x 25mm | | **Fin Configuration** | Fine-Pitch (Cross-Cut) | --- ### 2. Breakdown of the Part Number The part number follows the standard ATS naming convention: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **07**: Series identifier. * **G**: Material or specific mounting hardware type. * **82**: Unique design/footprint identifier. * **C2**: Material and Finish code (typically indicates Aluminum with Blue Anodized finish). * **R0**: Revision or packaging code. --- ### 3. Key Electronic Functions #### A. Thermal Dissipation This part is a **passive cooling** component. It increases the surface area of a heat-generating electronic device, allowing air (either via natural convection or forced airflow from a fan) to carry heat away more efficiently. #### B. pushPIN™ Attachment Unlike adhesive tapes or simple clips, the **pushPIN™** system uses a flexible spring-loaded mechanism. This ensures: 1. **Uniform Pressure:** Constant contact between the heat sink and the chip. 2. **Reliability:** Better resistance to shock and vibration compared to thermal tape. 3. **Ease of Assembly:** Quick installation into pre-drilled holes on a PCB. #### C. Thermal Interface Material (TIM) Typically, these units come with a pre-applied **Phase Change Material** or thermal pad on the base to fill microscopic air gaps between the component and the heat sink, maximizing heat transfer. --- ### 4. Typical Applications * **Embedded Systems:** Industrial PCs and controllers. * **Telecommunications:** Routers and switches. * **Power Electronics:** Voltage regulators and high-speed motor drivers.