ATS-07G-90-C2-R0
AI

The **ATS-07G-90-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for securing cooling solutions to Printed Circuit Boards (PCBs).
### 1. Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Brass) |
| **Fin Style** | Straight (Fine Pitch) |
| **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 25.00mm |
| **Thermal Resistance** | 6.36°C/W @ 100 LFM |
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### 2. Key Component Features
#### A. Material and Coating
* **Aluminum Construction:** Offers a lightweight solution with high thermal conductivity.
* **Blue Anodized Finish:** The anodized layer provides corrosion resistance and increased emissivity, which slightly improves radiative cooling.
#### B. Mounting Mechanism (Push-Pin)
* The part uses a **Brass Push-Pin** with a **Steel Spring**.
* **Advantage:** This ensures a consistent pressure (compression) on the electronic component (like a CPU or FPGA), which optimizes the thermal interface material (TIM) performance.
* **Hole Pattern:** Specifically designed for pre-drilled holes in the PCB.
#### C. Fin Design
* The "90" in the part number refers to a specific fin density and configuration within the ATS product line.
* It utilizes a **straight fin** geometry, which is ideal for systems with directed airflow (unidirectional air movement).
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### 3. Thermal Performance Profile
The efficiency of this heat sink depends on the airflow (Measured in Linear Feet per Minute - LFM):
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (Natural/Low) | 6.36 |
| 200 (Medium) | 3.35 |
| 400 (High) | 2.15 |
| 600 (Ultra) | 1.60 |
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### 4. Typical Applications
This electronic part is commonly used to cool:
* **Microprocessors (CPUs)** and **Microcontrollers**.
* **High-speed FPGAs** or ASICs.
* **Power Supplies** and Video Processors where vertical space allows for a 25mm height.
- ⤷
How do I calculate the required hole pattern for the push-pin mounting?
- ⤷ What type of thermal interface material (TIM) is recommended for this heat sink?
- ⤷ Are there low-profile versions of the ATS-07 series available?