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  • ATS-07G-90-C2-R0

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    The **ATS-07G-90-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for securing cooling solutions to Printed Circuit Boards (PCBs). ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Fin Style** | Straight (Fine Pitch) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 25.00mm | | **Thermal Resistance** | 6.36°C/W @ 100 LFM | --- ### 2. Key Component Features #### A. Material and Coating * **Aluminum Construction:** Offers a lightweight solution with high thermal conductivity. * **Blue Anodized Finish:** The anodized layer provides corrosion resistance and increased emissivity, which slightly improves radiative cooling. #### B. Mounting Mechanism (Push-Pin) * The part uses a **Brass Push-Pin** with a **Steel Spring**. * **Advantage:** This ensures a consistent pressure (compression) on the electronic component (like a CPU or FPGA), which optimizes the thermal interface material (TIM) performance. * **Hole Pattern:** Specifically designed for pre-drilled holes in the PCB. #### C. Fin Design * The "90" in the part number refers to a specific fin density and configuration within the ATS product line. * It utilizes a **straight fin** geometry, which is ideal for systems with directed airflow (unidirectional air movement). --- ### 3. Thermal Performance Profile The efficiency of this heat sink depends on the airflow (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low) | 6.36 | | 200 (Medium) | 3.35 | | 400 (High) | 2.15 | | 600 (Ultra) | 1.60 | --- ### 4. Typical Applications This electronic part is commonly used to cool: * **Microprocessors (CPUs)** and **Microcontrollers**. * **High-speed FPGAs** or ASICs. * **Power Supplies** and Video Processors where vertical space allows for a 25mm height.
    ✨ Follow-up Questions
    • ⤷ How do I calculate the required hole pattern for the push-pin mounting?
    • ⤷ What type of thermal interface material (TIM) is recommended for this heat sink?
    • ⤷ Are there low-profile versions of the ATS-07 series available?