ATS-07G-92-C2-R0
AI

The **ATS-07G-92-C2-R0** is a specific electronic component belonging to the **Thermal Management** category. It is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*, specifically from their "push pin" series.
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### 1. Technical Specifications
The following table highlights the physical and thermal characteristics of this specific part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) |
| **Base Part Number** | ATS-07G-92 |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 16.48°C/W (Natural Convection) |
| **Dimensions (L x W x H)** | 40mm x 40mm x 15mm |
| **Attachment Method** | Push-Pin (Brass) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Design and Construction
The ATS-07G-92-C2-R0 is engineered for efficient heat dissipation in confined spaces:
* **Finned Design:** It features a "Cross-Cut" or straight fin pattern (depending on the specific series iteration) designed to maximize surface area while allowing airflow from multiple directions.
* **Material:** The use of **6063 Aluminum** provides a balance between high thermal conductivity and lightweight properties.
* **Blue Anodized Coating:** The blue finish is not just aesthetic; anodizing increases corrosion resistance and improves emissivity, slightly enhancing radiative heat transfer.
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### 3. Attachment Mechanism (Push-Pin)
This part is known for its "Push-Pin" mounting system, which offers several advantages for PCB assembly:
1. **Uniform Pressure:** The brass push-pins are equipped with springs that provide consistent downward force on the electronic component (CPU, GPU, or MOSFET).
2. **Reliability:** Unlike adhesive tapes, mechanical push-pins remain secure even under high-vibration or high-temperature environments.
3. **Ease of Install:** Two-piece expansion pins pass through pre-drilled holes in the PCB and "snap" into place.
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### 4. Typical Applications
This heat sink is commonly used to cool high-heat-generating components in the following industries:
* **Telecommunications:** Network switches, routers, and base stations.
* **Computing:** Embedded systems, industrial PCs, and power supplies.
* **Automotive:** Electronic Control Units (ECUs) and infotainment systems.
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- ⤷
How does the T766 thermal interface material compare to standard thermal grease?
- ⤷ What are the PCB hole requirements for mounting this specific push-pin heat sink?
- ⤷ Can this heat sink be used for active cooling with an attached fan?