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  • ATS-07G-92-C2-R0

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    The **ATS-07G-92-C2-R0** is a specific electronic component belonging to the **Thermal Management** category. It is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*, specifically from their "push pin" series. --- ### 1. Technical Specifications The following table highlights the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Base Part Number** | ATS-07G-92 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 16.48°C/W (Natural Convection) | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design and Construction The ATS-07G-92-C2-R0 is engineered for efficient heat dissipation in confined spaces: * **Finned Design:** It features a "Cross-Cut" or straight fin pattern (depending on the specific series iteration) designed to maximize surface area while allowing airflow from multiple directions. * **Material:** The use of **6063 Aluminum** provides a balance between high thermal conductivity and lightweight properties. * **Blue Anodized Coating:** The blue finish is not just aesthetic; anodizing increases corrosion resistance and improves emissivity, slightly enhancing radiative heat transfer. --- ### 3. Attachment Mechanism (Push-Pin) This part is known for its "Push-Pin" mounting system, which offers several advantages for PCB assembly: 1. **Uniform Pressure:** The brass push-pins are equipped with springs that provide consistent downward force on the electronic component (CPU, GPU, or MOSFET). 2. **Reliability:** Unlike adhesive tapes, mechanical push-pins remain secure even under high-vibration or high-temperature environments. 3. **Ease of Install:** Two-piece expansion pins pass through pre-drilled holes in the PCB and "snap" into place. --- ### 4. Typical Applications This heat sink is commonly used to cool high-heat-generating components in the following industries: * **Telecommunications:** Network switches, routers, and base stations. * **Computing:** Embedded systems, industrial PCs, and power supplies. * **Automotive:** Electronic Control Units (ECUs) and infotainment systems. ---
    ✨ Follow-up Questions
    • ⤷ How does the T766 thermal interface material compare to standard thermal grease?
    • ⤷ What are the PCB hole requirements for mounting this specific push-pin heat sink?
    • ⤷ Can this heat sink be used for active cooling with an attached fan?