The **ATS-07H-10-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is designed for cooling electronic components, specifically integrated circuits (ICs) like CPUs, GPUs, and FPGAs that generate significant heat during operation. ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Attachment Type** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | 7.89°C/W (Unducted Flow @ 100 LFM) | | **Airflow Direction** | Vertical / Top-down | --- ### Core Components and Design Features #### 1. Heat Sink Body (Aluminum) The body is made of lightweight aluminum, which offers excellent thermal conductivity. The **Blue Anodized** finish is not just aesthetic; it provides surface protection against corrosion and slightly improves radiant heat transfer. #### 2. Fin Configuration This model utilizes a **cross-cut** or **pin-fin** design. This allows for: * **Multidirectional Airflow:** Heat can be dissipated regardless of the direction of the air entering the system. * **Increased Surface Area:** The fine fin structure maximizes the area in contact with the air to accelerate cooling. #### 3. Push-Pin Attachment Mechanism Instead of using messy adhesives or permanent thermal epoxy, this part uses a **Push-Pin** system: * **Precision Springs:** Provide consistent pressure (clamping force) across the component to ensure optimal thermal contact. * **Plastic/Brass Pins:** Secure the heat sink through pre-drilled holes in the Printed Circuit Board (PCB). #### 4. Thermal Interface Material (TIM) The "R0" designation typically implies that the unit comes with a pre-applied **Thermal Interface Material** (like T766). This fills the microscopic air gaps between the component and the heat sink to ensure efficient heat transfer. --- ### Thermal Performance Overview | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 7.89 | | 200 (1.0 m/s) | 2.70 | | 400 (2.0 m/s) | 1.43 | | 600 (3.0 m/s) | 1.07 | *As shown above, the efficiency of the heat sink increases drastically as airflow (LFM) increases.* --- ### Applications * **Telecommunications:** Cooling networking chips and processors. * **Industrial PCs:** Maintaining stability in high-temperature environments. * **Power Supplies:** Dissipating heat from high-speed switching transistors.