The **ATS-07H-115-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications Below are the key mechanical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 40.00mm x 40.00mm x 25.00mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 1.75°C/W (at 200 LFM) | | **Fin Type** | XC-CUT (Cross-cut for multi-directional flow) | --- ## 2. Key Electronic Features ### A. pushPIN™ Attachment System Unlike traditional adhesive tapes or simple clips, the **ATS-07H-115-C2-R0** uses a "pushPIN" system. This is critical for electronics because: * **Constant Pressure:** It ensures uniform contact between the chip surface and the heat sink. * **Secure Mounting:** It prevents the heat sink from shifting during vibration or transport. * **Ease of Maintenance:** It allows for repeated installation and removal without damaging the PCB. ### B. Thermal Interface Material (TIM) This part comes pre-applied with **T766**, a high-quality thermal interface material. In electronics, the TIM fills microscopic air gaps between the component and the heat sink, significantly reducing thermal resistance and improving heat transfer efficiency. ### C. XC-CUT Fin Design The "XC-CUT" indicates a cross-cut fin geometry. This is specifically engineered for: * **Non-linear Airflow:** If the cooling fan is not perfectly aligned, the cross-cuts allow air to enter from multiple angles. * **Increased Surface Area:** Maximizes the area available for heat dissipation within a 40mm footprint. --- ## 3. Common Applications This heat sink is typically found in the following electronic environments: 1. **Telecommunications:** Cooling high-speed networking chips and routers. 2. **Embedded Systems:** Industrial PCs where high reliability is required. 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. ---