The part number **ATS-07H-121-C2-R0** refers to a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). While it is a mechanical component, it is critical for the thermal management of electronic systems. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 9.48°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 10mm | | **Fin Type** | Fine Pitch (Cross-Cut) | --- ### 2. Breakdown of the Part Number The naming convention provides specific details about the component: * **ATS**: Advanced Thermal Solutions (Manufacturer). * **07**: Series identifier (typically related to fin configuration). * **H**: High performance/High density. * **121**: Specific geometry/size code. * **C2**: Refers to the thermal interface material (TIM) or specific coating; "C2" often denotes **T766 phase change material**. * **R0**: RoHS compliant revision. --- ### 3. Electronic Application & Importance This heat sink is designed to protect sensitive electronic components from overheating. #### Key Functions: * **Dissipation of Heat:** It increases the surface area of a semiconductor (like a CPU, GPU, or FPGA), allowing the surrounding air to carry away heat more efficiently. * **pushPIN™ Technology:** The assembly includes a flexible, spring-loaded attachment mechanism that ensures consistent pressure on the electronic chip, optimizing heat transfer through the Thermal Interface Material (TIM). * **Directional Airflow:** The "Cross-Cut" fin design is optimized for environments where airflow might come from multiple directions, making it versatile for tightly packed circuit boards (PCBs). --- ### 4. Component Comparison: Thermal Resistance Thermal resistance measures how effectively the part prevents heat buildup. Lower numbers are better under high-flow conditions. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 9.48 | | 300 (1.5 m/s) | 4.47 | | 500 (2.5 m/s) | 3.44 |