ATS-07H-124-C2-R0
AI

The part number **ATS-07H-124-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" attachment series designed for cooling electronic components such as CPUs, GPUs, or high-power transistors.
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### 1. Technical Specifications
Below are the primary mechanical and thermal properties of this component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Spring-loaded) |
| **Dimensions** | 50.00mm x 50.00mm |
| **Height** | 25.00mm |
| **Thermal Resistance** | 3.18°C/W (at 100 LFM) |
| **Fin Style** | Straight Fin |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Breakdown of the Part Number
The part number follows a specific nomenclature used by Advanced Thermal Solutions:
* **ATS**: Manufacturer (Advanced Thermal Solutions).
* **07H**: Series designation (Push-pin heat sink family).
* **124**: Specific size and fin geometry identifier.
* **C2**: Material and Finish (typically signifies Aluminum with Blue Anodized finish).
* **R0**: Revision/Packaging code.
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### 3. Key Electronic Functions
While this is a mechanical part, its role in an electronic system is critical for stability and longevity:
1. **Thermal Management**: It dissipates heat from an Integrated Circuit (IC) to the ambient air, preventing thermal throttling or hardware failure.
2. **Increased Surface Area**: The vertical fins increase the contact area with air, facilitating heat transfer via convection (forced or natural).
3. **Mechanical Coupling**: The push-pin mechanism ensures a consistent downward pressure on the chip, which is vital for the efficiency of the Thermal Interface Material (TIM).
4. **T766 TIM**: The pre-applied "T766" phase-change material fills microscopic air gaps between the chip surface and the heat sink base to maximize heat conduction.
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### 4. Implementation Considerations
When using this part in a PCB design, consider the following:
* **Hole Pattern**: Ensure the PCB has the correct hole diameters and spacing to accommodate the push-pins.
* **Airflow Direction**: The straight fin design is optimized for unidirectional airflow.
* **Keep-out Zones**: Account for the 50x50mm footprint to avoid interference with nearby capacitors or connectors.
- ⤷What are the PCB hole requirements for the push-pin attachment?
- ⤷ How does the T766 thermal material compare to standard thermal paste?
- ⤷ Is this heat sink suitable for passive cooling without a fan?