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  • ATS-07H-124-C2-R0

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    The part number **ATS-07H-124-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" attachment series designed for cooling electronic components such as CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications Below are the primary mechanical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions** | 50.00mm x 50.00mm | | **Height** | 25.00mm | | **Thermal Resistance** | 3.18°C/W (at 100 LFM) | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **07H**: Series designation (Push-pin heat sink family). * **124**: Specific size and fin geometry identifier. * **C2**: Material and Finish (typically signifies Aluminum with Blue Anodized finish). * **R0**: Revision/Packaging code. --- ### 3. Key Electronic Functions While this is a mechanical part, its role in an electronic system is critical for stability and longevity: 1. **Thermal Management**: It dissipates heat from an Integrated Circuit (IC) to the ambient air, preventing thermal throttling or hardware failure. 2. **Increased Surface Area**: The vertical fins increase the contact area with air, facilitating heat transfer via convection (forced or natural). 3. **Mechanical Coupling**: The push-pin mechanism ensures a consistent downward pressure on the chip, which is vital for the efficiency of the Thermal Interface Material (TIM). 4. **T766 TIM**: The pre-applied "T766" phase-change material fills microscopic air gaps between the chip surface and the heat sink base to maximize heat conduction. --- ### 4. Implementation Considerations When using this part in a PCB design, consider the following: * **Hole Pattern**: Ensure the PCB has the correct hole diameters and spacing to accommodate the push-pins. * **Airflow Direction**: The straight fin design is optimized for unidirectional airflow. * **Keep-out Zones**: Account for the 50x50mm footprint to avoid interference with nearby capacitors or connectors.
    ✨ Follow-up Questions
    • ⤷What are the PCB hole requirements for the push-pin attachment?
    • ⤷ How does the T766 thermal material compare to standard thermal paste?
    • ⤷ Is this heat sink suitable for passive cooling without a fan?