The **ATS-07H-14-C2-R0** is a high-performance electronic component classified as a **Heat Sink**. It is designed for thermal management of surface-mount electronic components, such as BGA (Ball Grid Array) chips, CPUs, or GPUs, to prevent overheating. ### Technical Specifications The following table summarizes the key physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin | | **Dimensions (L x W)** | 50.00mm x 50.00mm | | **Height** | 20.00mm | | **Thermal Resistance** | 0.99°C/W (@ 100 LFM) | | **Flow Direction** | Vertical (Cross-Cut) | --- ### Key Electronic & Mechanical Features #### 1. Thermal Performance The "C2" in the part number indicates a specific thermal interface material or performance grade. This heat sink is designed for a low thermal resistance of **0.99°C/W** under moderate airflow, meaning it is highly efficient at transferring heat away from the semiconductor die to the ambient air. #### 2. pushPIN™ Attachment System Unlike adhesive-based heat sinks, this model uses a mechanical push-pin system. * **Spring-loaded:** Ensures consistent pressure on the electronic component for optimal heat transfer. * **Secure:** Prevents the heat sink from shifting due to vibration or thermal expansion. * **Bore Hole:** Requires pre-drilled holes on the PCB (typically 3.00mm). #### 3. Material and Coating * **Aluminum 6063:** Provides high thermal conductivity while remaining lightweight. * **Blue Anodized Finish:** This is not just for aesthetics; the anodization layer provides corrosion resistance and slightly improves radiative heat transfer. #### 4. Fin Design The part features a **cross-cut** fin pattern. This allows airflow from multiple directions, making it ideal for electronic enclosures where the internal fan placement might not provide perfectly linear airflow. --- ### Typical Applications * **Networking Equipment:** Routers, switches, and base stations. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling voltage regulators or power transistors.