The **ATS-07H-141-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the blueICE™ series, specifically designed for cooling electronic components like CPUs, GPUs, and other integrated circuits that require efficient thermal management. --- ## 1. Technical Specifications Below are the primary technical parameters for this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 15.76°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 10.00mm | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Electronic/Physical Composition The "electronic" relevance of this part lies in its ability to protect semiconductor junctions from overheating. ### A. Material Properties * **Aluminum Body:** Chosen for its high thermal conductivity and lightweight properties, ensuring it doesn't strain the PCB. * **Blue Anodized Coating:** Provides surface protection against corrosion and increases surface emissivity for better radiant heat transfer. ### B. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, the `-R0` suffix indicates a mechanical attachment: * **Spring-loaded bolts:** Provide precise pressure (load) on the processor, ensuring optimal contact with the Thermal Interface Material (TIM). * **Secure Mounting:** Prevents the heat sink from shifting during mechanical shock or vibration, common in industrial or mobile electronics. ### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied. This is a phase-change material or high-performance grease that fills microscopic air gaps between the heat sink and the electronic chip, significantly reducing thermal impedance. --- ## 3. Thermal Performance Analysis Efficiency depends on the airflow (LFM - Linear Feet per Minute) within the electronic enclosure: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 15.76 | | 300 (1.5 m/s) | 8.92 | | 500 (2.5 m/s) | 7.18 | | 700 (3.5 m/s) | 6.33 | --- ## 4. Common Applications This heat sink is typically found in: * **Network Switches/Routers:** Cooling ASICs. * **Embedded Systems:** Protecting SoCs in compact enclosures. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators.