The **ATS-07H-142-C3-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** product line, specifically designed to cool electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Fin Type** | maxiFLOW (Tapered Fin Design) | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 4.85 °C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 30mm x 30mm x 15mm | | **Compatibility** | Pre-drilled for push-pin mounting | --- ### 2. Key Design Elements #### A. maxiFLOW™ Fin Geometry Unlike standard square-cut fins, the maxiFLOW™ design uses a flared, tapered fin profile. This increases the surface area exposed to air while reducing pressure drop, making it highly efficient in forced-air environments (using fans). #### B. pushPIN™ Attachment System The "R0" designation indicates it uses the **pushPIN™** mounting system. This includes: * A flexible spring-loaded mechanism. * Reliable pressure application to ensure maximum contact between the heat sink and the component. * Ease of installation without specialized tools. #### C. Thermal Interface Material (TIM) This specific model usually comes with **T412** thermal tape or pre-applied Phase Change Material. The "C3" in the part number often indicates the type of thermal performance coating or specific material variant used for that series. --- ### 3. Applications This part is commonly used in the following electronic sectors: * **Telecommunications:** Cooling high-speed signal processors. * **Embedded Systems:** For compact industrial PC boards. * **Networking:** Switch and router chips where airflow is directional. * **Automotive:** Cooling internal control modules. ---