The **ATS-07H-166-C3-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** product line, specifically designed to dissipate heat from electronic components like CPUs, GPUs, FPGAs, and ASICs. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Product Series** | maxiFLOW™ | | **Material** | Aluminum (Anodized Blue) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 15.00mm | | **Thermal Resistance** | 12.30°C/W (Unducted Flow) | | **Attachment Method** | pushPIN™ | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Component Features #### A. The Fin Design (maxiFLOW™) The "maxiFLOW" design uses a **tapered fin structure**. This geometry is engineered to maximize surface area while minimizing pressure drop. This allows air to flow more efficiently through the fins, making it highly effective in forced-air environments (fans). #### B. The pushPIN™ Attachment System Instead of using messy adhesives or thermal tape, this model uses a mechanical **pushPIN™** system: * **Secure Fit:** Provides consistent pressure across the component surface for better thermal transfer. * **Easy Installation:** Uses a spring-loaded pin that clicks into pre-drilled holes on the PCB. * **Reliability:** Resistant to shock and vibration compared to "peel-and-stick" alternatives. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. * **Function:** This material fills the microscopic air gaps between the heat sink and the electronic chip. * **Benefit:** It ensures the lowest possible thermal resistance right out of the box. --- ### 3. Applications This specific heat sink is typically used for cooling: * **Networking Gear:** Routers, switches, and base stations. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Large MOSFET arrays or power converters that generate concentrated heat in a 45x45mm footprint. --- ### 4. Thermal Performance Comparison *At various airflow rates (Linear Feet per Minute - LFM):* | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 12.30 | | 200 | 9.20 | | 300 | 7.30 | | 400 | 6.00 |