The part number **ATS-07H-17-C2-R0** refers to a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). This component belongs to the "push-pin" series designed for efficient thermal management of electronic components like CPUs, GPUs, and FPGAs. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Type** | Push-Pin (Plastic) | | **Thermal Resistance** | 15.44°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 12.70mm | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Component Breakdown The part number follows a specific nomenclature used by ATS to identify its properties: ### A. Physical Structure - **ATS-07**: Refers to the specific series/profile of the heat sink. - **H**: Indicates a high-performance fin geometry. - **17**: Corresponds to the height (12.70mm) and specific footprint dimensions. - **C2**: Refers to the material and finish (typically aluminum with a blue anodized coating). ### B. Mounting Mechanism The **Push-Pin** system is used to secure the heat sink to the PCB. - It consists of a flexible spring-loaded pin that snaps into pre-drilled holes in the motherboard. - This ensures constant pressure on the electronic chip, optimizing heat transfer. ### C. Thermal Interface Material (TIM) The **R0** suffix indicates that the part comes with **T766** phase-change material pre-applied to the base. This eliminates the need for manual application of thermal paste and ensures a low-resistance path between the component and the heat sink. --- ## 3. Application Use Cases This specific heat sink is used in environments where vertical space is limited (low profile) but high surface area is required for cooling. 1. **Telecommunications**: Cooling line cards and routers. 2. **Industrial PCs**: Heat dissipation for embedded processors. 3. **Power Supplies**: Managing heat for MOSFETs and power regulators. ---