The **ATS-07H-170-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like processors, GPUs, and power modules. ### 1. Technical Specifications The following table summarizes the physical and thermal properties of this specific model: | Property | Description/Value | | :--- | :--- | | **Material** | Aluminum (Blue Anodized Finish) | | **Heat Sink Type** | Push-Pin (Passive Cooling) | | **Dimension (L x W x H)** | 30.00mm x 30.00mm x 15.00mm | | **Thermal Resistance** | 5.44°C/W (at 100 LFM) | | **Attachment Method** | Push-Pin (with Compression Spring) | | **Flow Orientation** | Vertical or Horizontal (Open Fin Design) | | **Fin Pattern** | Fine Pitch (Rectangular Fin) | --- ### 2. Key Features and Components #### A. Thermal Material The "C2" in the part number indicates the type of **Thermal Interface Material (TIM)** pre-applied to the base. This model typically features **T766**, a high-performance thermal grease that ensures maximum heat transfer between the electronic component (IC) and the aluminum heat sink. #### B. Attachment Mechanism (Push-Pins) Unlike adhesive-based heat sinks, this model uses a mechanical mounting system: * **Pins:** Usually made of plastic or brass. * **Springs:** Provides consistent pressure (force) to ensure the heat sink remains in contact with the chip, even during mechanical shock or vibration. * **Hole Pattern:** Requires specific pre-drilled holes in the PCB. #### C. Fin Geometry The fins are designed to maximize surface area while maintaining low pressure drop. This allows it to work effectively in both **natural convection** (passive airflow) and **forced convection** (using a fan). --- ### 3. Thermal Performance Analysis The effectiveness of this heat sink varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (Natural)** | 5.44 | | **200** | 3.85 | | **300** | 3.19 | | **400** | 2.81 | --- ### 4. Applications * **BGA (Ball Grid Array) Cooling:** Used for FPGAs and ASICs. * **Embedded Systems:** Ideal for compact industrial PCs. * **Power Supplies:** Cooling voltage regulators or MOSFETs.