The **ATS-07H-175-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 🛠️ Technical Specifications The part belongs to the **pushPIN™** series, known for its secure mounting mechanism and efficient airflow design. | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Plastic Pins & Springs) | | **Thermal Resistance** | 13.52 °C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 10.00mm | | **Fin Style** | Fine Pitch (Cross-Cut) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 🔍 Key Component Features ### 1. Fine-Pitch Fin Design The heat sink utilizes a **cross-cut** or fine-pitch pattern. This increases the total surface area available for heat exchange without significantly increasing the physical footprint of the part. This is critical for space-constrained PCB layouts. ### 2. pushPIN™ Attachment System Instead of using messy adhesives or complex clips, this part uses a standardized **pushPIN™** system: * **Springs:** Provide precise pressure to ensure maximum contact between the heat sink and the component. * **Pins:** Available in brass or plastic to secure the assembly through pre-drilled holes in the PCB. ### 3. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a high-performance thermal grease that fills microscopic air gaps between the heat sink and the electronic chip, significantly lowering thermal resistance. --- ## 📊 Performance Data (Airflow) Thermal performance varies based on the velocity of the air moving through the fins (measured in Linear Feet per Minute - LFM): | Air Velocity | 100 LFM | 300 LFM | 500 LFM | | :--- | :--- | :--- | :--- | | **Thermal Resistance (Unducted)** | 13.52 °C/W | 5.13 °C/W | 3.63 °C/W | | **Thermal Resistance (Ducted)** | 3.63 °C/W | 2.50 °C/W | 2.07 °C/W | --- ## 💡 Typical Applications * **Embedded Systems:** Cooling microprocessors in industrial PCs. * **Telecommunications:** Dissipating heat from high-speed networking chips. * **Power Electronics:** Cooling MOSFETs or voltage regulators.