The **ATS-07H-192-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is a passive electronic component designed to dissipate heat from integrated circuits (ICs), such as CPUs, GPUs, or power transistors, to prevent thermal throttling or hardware failure. ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions and thermal properties. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Base Series** | pushPIN™ Heat Sink | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W)** | 45.00 mm x 45.00 mm | | **Height (H)** | 30.00 mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 2.35°C/W (at 100 LFM) | --- ### 2. Key Physical Components The performance of this part is determined by three main electronic/mechanical design factors: * **Heat Sink Body:** Constructed from high-grade aluminum. It uses a "Straight Fin" design, which provides a large surface area for air to pass through, effectively transferring heat from the base to the atmosphere. * **Push-Pin Attachment:** This model uses a spring-loaded push-pin mechanism. This ensures consistent pressure between the heat sink and the electronic component, which is critical for maximizing thermal transfer. * **Thermal Interface Material (TIM):** The "R0" suffix often indicates that a high-performance **T766 phase change material** or similar pre-applied thermal pad is included on the base. This fills microscopic air gaps between the chip and the heat sink. --- ### 3. Thermal Performance Data Thermal resistance indicates how many degrees Celsius the component's temperature will rise for every watt of power dissipated. | Airflow Velocity | Thermal Resistance (Unducted) | | :--- | :--- | | **100 LFM (0.5 m/s)** | 2.35 °C/W | | **200 LFM (1.0 m/s)** | 1.41 °C/W | | **300 LFM (1.5 m/s)** | 1.17 °C/W | | **500 LFM (2.5 m/s)** | 0.99 °C/W | --- ### 4. Application and Compatibility This part is typically found in: * **Telecommunications:** High-speed routers and switches. * **Computing:** Embedded systems and industrial PC motherboards. * **Power Electronics:** Power supply modules and motor controllers. The **45mm x 45mm** footprint is standard for many BGA (Ball Grid Array) packages, making it a versatile cooling solution for medium-to-high power electronic chips.