The **ATS-07H-202-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" attachment series designed for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Property | Description | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 14.83 °C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W)** | 54.00 mm x 54.00 mm | | **Height (Fin Profile)** | 6.00 mm | | **Number of Fins** | XC (Cross-Cut) Design | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Design Features * **XC (Cross-Cut) Fin Pattern:** Unlike straight fins, the XC design features square or rectangular pins/blocks. This allows for multi-directional airflow, making the heat sink effective even if the air is not blowing directly down the rows. * **Push-Pin Mounting:** The part uses a spring-loaded push-pin mechanism. This provides a consistent, high-pressure contact between the heat sink and the component, which is critical for efficient heat transfer. * **Low Profile:** With a height of only 6.00 mm, this part is specifically designed for space-constrained electronics, such as 1U servers, thin clients, or compact embedded systems. * **Blue Anodized Coating:** The anodization increases surface emissivity (improving radiation heat transfer) and provides electrical insulation and corrosion resistance. --- ### 3. Thermal Performance Metrics Thermal performance depends heavily on the velocity of the air passing through the fins (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 14.83 | | **400 (2.0 m/s)** | 6.91 | | **600 (3.0 m/s)** | 5.10 | | **800 (4.0 m/s)** | 4.34 | --- ### 4. Application Usage This part is typically used for cooling: 1. **BGA Packages:** High-density Ball Grid Arrays. 2. **FPGA/ASIC:** Custom logic chips that generate localized heat. 3. **Power Electronics:** Voltage regulators or power modules in telecommunication hardware.