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  • ATS-07H-210-C2-R0

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    The **ATS-07H-210-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the physical and thermal properties of the component. | Property | Specification | | :--- | :--- | | **Product Type** | Heat Sink | | **Series** | pushPIN™ HS | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push-Pin (Plastic) | | **Base Finish** | Blue Anodized | | **Dimensions** | 70mm x 70mm x 12mm | | **Thermal Resistance** | 5.18°C/W (at 100 LFM) | --- ### 2. Design Features The **ATS-07H-210-C2-R0** is designed for high-density electronic cooling. * **Fin Profile:** It utilizes a **Fine-Pitch** fin design. This maximizes the surface area within a small footprint, which is critical for dissipating heat in constrained spaces. * **Push-Pin Attachment:** Instead of using messy thermal adhesives or complex brackets, it uses a standardized push-pin mechanism with a specific spring force. This ensures consistent pressure on the processor or component for optimal heat transfer. * **Airflow Optimization:** The design is intended for forced air (fan-cooled) environments. Its thermal resistance drops significantly as the Linear Feet per Minute (LFM) of airflow increases. --- ### 3. Application Use Cases This specific model is commonly used for cooling "Hot" components on a PCB where vertical clearance is limited (since it is only 12mm tall). 1. **Processors (CPUs/GPUs):** For low-profile embedded systems. 2. **ASICs and FPGAs:** High-speed integrated circuits that generate localized heat. 3. **Power Supplies:** Cooling MOSFETs or power conversion modules. 4. **Telecommunications:** Used in rack-mounted networking gear where horizontal space is plentiful but vertical space is tight. --- ### 4. Part Number Breakdown The suffix codes provide detail on the material and color: * **C2:** Refers to the thermal interface material (TIM) or specific coating (usually implies a high-performance T766 thermal pad or grease is included). * **R0:** Indicates the revision and typically signifies compliance with environmental standards like RoHS.
    ✨ Follow-up Questions
    • ⤷ How does the thermal resistance of this heat sink change at higher airflow rates (e.g.
    • ⤷ 500 LFM)?
    • ⤷ What are the specific hole-to-hole mounting dimensions for the ATS-07H-210-C2-R0?
    • ⤷ What is the difference between Blue Anodized and Black Anodized finishes in thermal performance?