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  • ATS-07H-23-C2-R0

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    The part number **ATS-07H-23-C2-R0** refers to a high-performance **Heatsink** manufactured by *Advanced Thermal Solutions (ATS)*. It is part of their "push pin" series designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number is a coded string that defines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Thermal Resistance** | 12.01° C/W @ 100 LFM | | **Dimensions (L x W x H)** | 60mm x 60mm x 15mm | | **Fin Style** | Cross-Cut (Pin Fin) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied phase change material) | --- ### 2. Breakdown of the Part Number Advanced Thermal Solutions uses a specific nomenclature to identify their parts: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **07**: Series designation (specific to the attachment and fin style). * **H**: High performance / Specific fin density. * **23**: Length/Width dimension code (60mm square). * **C2**: Material and Finish (Aluminum with Blue Anodized coating). * **R0**: Version or Revision code. --- ### 3. Key Electronic Functions While a heatsink is a passive mechanical part, its role in an electronic circuit is critical: 1. **Thermal Management**: It increases the surface area of the heat-generating component, allowing for more efficient heat dissipation into the surrounding air. 2. **Junction Temperature Control**: By maintaining lower temperatures, it prevents "Thermal Throttling" and extends the lifespan of the semiconductor. 3. **Mechanical Attachment**: The push-pin mechanism provides a specific "clamping force" (measured in PSI) to ensure the Thermal Interface Material (TIM) fills microscopic gaps between the chip and the heatsink. --- ### 4. Thermal Performance Comparison Thermal resistance is measured in Celsius per Watt (°C/W). Lower values indicate better cooling performance. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural Convection) | 12.01 | | 200 (Low Fan Speed) | 8.34 | | 300 (Moderate Fan Speed) | 6.71 | | 400 (High Fan Speed) | 5.91 | ---
    ✨ Follow-up Questions
    • ⤷What is the difference between Blue Anodized and Black Anodized finishes in terms of thermal radiation?
    • ⤷ How do I calculate if 12.01° C/W is sufficient for my specific processor?
    • ⤷ What are the mounting hole diameter requirements for the push-pin attachment?