ATS-07H-23-C2-R0
AI

The part number **ATS-07H-23-C2-R0** refers to a high-performance **Heatsink** manufactured by *Advanced Thermal Solutions (ATS)*. It is part of their "push pin" series designed for cooling electronic components like CPUs, GPUs, or high-power transistors.
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### 1. Technical Specifications
The part number is a coded string that defines the physical and thermal properties of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push Pin (Plastic/Brass) |
| **Thermal Resistance** | 12.01° C/W @ 100 LFM |
| **Dimensions (L x W x H)** | 60mm x 60mm x 15mm |
| **Fin Style** | Cross-Cut (Pin Fin) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied phase change material) |
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### 2. Breakdown of the Part Number
Advanced Thermal Solutions uses a specific nomenclature to identify their parts:
* **ATS**: Manufacturer (Advanced Thermal Solutions).
* **07**: Series designation (specific to the attachment and fin style).
* **H**: High performance / Specific fin density.
* **23**: Length/Width dimension code (60mm square).
* **C2**: Material and Finish (Aluminum with Blue Anodized coating).
* **R0**: Version or Revision code.
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### 3. Key Electronic Functions
While a heatsink is a passive mechanical part, its role in an electronic circuit is critical:
1. **Thermal Management**: It increases the surface area of the heat-generating component, allowing for more efficient heat dissipation into the surrounding air.
2. **Junction Temperature Control**: By maintaining lower temperatures, it prevents "Thermal Throttling" and extends the lifespan of the semiconductor.
3. **Mechanical Attachment**: The push-pin mechanism provides a specific "clamping force" (measured in PSI) to ensure the Thermal Interface Material (TIM) fills microscopic gaps between the chip and the heatsink.
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### 4. Thermal Performance Comparison
Thermal resistance is measured in Celsius per Watt (°C/W). Lower values indicate better cooling performance.
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (Natural Convection) | 12.01 |
| 200 (Low Fan Speed) | 8.34 |
| 300 (Moderate Fan Speed) | 6.71 |
| 400 (High Fan Speed) | 5.91 |
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- ⤷What is the difference between Blue Anodized and Black Anodized finishes in terms of thermal radiation?
- ⤷ How do I calculate if 12.01° C/W is sufficient for my specific processor?
- ⤷ What are the mounting hole diameter requirements for the push-pin attachment?