The **ATS-07H-26-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" heat sink assembly system, designed specifically for thermal management of electronic components like CPUs, GPUs, and other integrated circuits. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-07H-26-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions** | 70.00mm x 70.00mm x 10.00mm | | **Thermal Resistance** | 14.20 °C/W (at 100 LFM / 0.5 m/s) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### Key Electronic Components & Design Elements #### 1. PushPIN™ Attachment System Instead of using messy adhesives or weak thermal tapes, this part uses a mechanical **pushPIN™** system. This ensures consistent pressure on the electronic component (IC), which is critical for maximizing heat transfer efficiency and preventing the heat sink from shifting during vibration. #### 2. Fin Profile (Fine Pitch) The "H" in the part number often denotes a specific fin height or density. This model features a **low-profile design** (10mm height). This is ideal for: * **1U or 2U Servers:** Where vertical space is restricted. * **Embedded Systems:** Small form factor enclosures. * **Telecommunications:** Dense networking hardware. #### 3. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied. This is a high-performance phase-change or grease-like material that fills microscopic air gaps between the flat surface of the heat sink and the electronic chip. #### 4. Material and Finish * **Aluminum 6063:** Provides a high thermal conductivity-to-weight ratio. * **Blue Anodizing:** This isn't just for aesthetics; it provides surface protection against corrosion and slightly improves heat radiation (emissivity). --- ### Application in Circuit Design In an electronic circuit, the ATS-07H-26-C2-R0 acts as a passive cooling component. It is selected based on the **Power Dissipation (Watts)** of the underlying component. With a thermal resistance of roughly 14.20 °C/W at low airflow, it is designed for chips that produce moderate heat but require a large surface area (70mm x 70mm) to dissipate energy effectively.