ATS-07H-27-C2-R0
AI

The part number **ATS-07H-27-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" component cooling series, designed specifically for thermal management in electronic circuits.
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### Technical Specifications
The following table outlines the physical and thermal properties of this specific model:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (Al6063) |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 70.00mm x 45.00mm x 12.00mm |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Fin Style** | Straight Fin |
| **Thermal Resistance** | 12.24 °C/W (at 100 LFM) |
| **Pitch** | 1.14mm (Fine Pitch) |
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### Key Features and Electronic Role
#### 1. Thermal Management
The primary role of the ATS-07H-27-C2-R0 is to dissipate heat from surface-mount electronic components such as **CPUs, GPUs, FPGAs, or MOSFETs**. By increasing the surface area exposed to air, it prevents the semiconductor junctions from reaching critical temperatures that could lead to thermal throttling or permanent failure.
#### 2. Push-Pin Attachment Mechanism
Unlike adhesive-based heat sinks, this model uses a **push-pin and compression spring** system.
* **Advantage:** It provides a precise, consistent pressure (clamping force) against the component.
* **Reliability:** The spring ensures that the thermal interface material (TIM) remains thin and efficient over time, even under mechanical vibration.
#### 3. Straight Fin Design
The "Straight Fin" geometry is optimized for **forced air cooling** (environments with a fan). The fins are oriented to allow air to flow through the channels, stripping heat away as it moves across the aluminum surface.
#### 4. Material Efficiency
Made from **6063 Aluminum**, the part offers a high strength-to-weight ratio and excellent thermal conductivity. The **Blue Anodized finish** is not just for aesthetics; it provides corrosion resistance and improves emissivity for radiative heat transfer.
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### Comparison with Similar Models
| Model Variant | Height (mm) | Thermal Resistance (100 LFM) |
| :--- | :--- | :--- |
| ATS-07H-27-C2-R0 | 12.00 | 12.24 °C/W |
| ATS-07H-28-C2-R0 | 15.00 | 10.10 °C/W |
| ATS-07H-29-C2-R0 | 20.00 | 7.57 °C/W |
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- ⤷What type of thermal interface material (TIM) is typically used with this heat sink?
- ⤷ How do I calculate the correct hole diameter for the push-pin installation?
- ⤷ Can this heat sink be used in a passive cooling (natural convection) environment?