Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-07H-29-C2-R0

  • AI
    The part number **ATS-07H-29-C2-R0** refers to a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications Below is the breakdown of the technical characteristics for this specific part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Thermal Resistance** | 7.57°C/W (at 100 LFM) | | **Fin Style** | Straight Fin | | **Compatibility** | Standard PCB hole patterns | --- ### 2. Part Number Nomenclature Understanding the code helps identify the physical properties: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **07H**: Series/Category (Push-pin heat sink family). * **29**: Specific dimensional profile (45mm length). * **C2**: Material/Finish code (Blue Anodized Aluminum). * **R0**: RoHS compliance status and revision level. --- ### 3. Electronic Application & Usage The ATS-07H-29-C2-R0 is an **Active/Passive Cooling Component**. While it does not consume electricity itself, it is critical for the following electronic functions: 1. **Thermal Management**: It draws heat away from integrated circuits (ICs) through conduction. 2. **Overheating Prevention**: By increasing the surface area for air convection, it prevents "thermal throttling" or hardware failure in high-performance chips. 3. **Pressure Application**: The push-pin mechanism uses a precise spring-loaded tension to ensure the heat sink maintains constant contact with the component's surface, often used in conjunction with a **Thermal Interface Material (TIM)** like thermal paste or pads. --- ### 4. Cooling Performance (LFM) Thermal resistance decreases as airflow increases. Performance varies based on Linear Feet per Minute (LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 7.57 | | 200 | 2.45 | | 300 | 1.70 | | 400 | 1.39 |
    ✨ Follow-up Questions
    • ⤷ What is the difference between blue anodized and black anodized finishes for heat sinks?
    • ⤷ How do I calculate the required thermal resistance for my specific CPU?
    • ⤷ What thermal interface material is recommended for use with this ATS model?