The **ATS-07H-32-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### Technical Specifications The following table outlines the key physical and thermal characteristics of the device: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. | | **Series** | pushPIN™ | | **Thermal Resistance** | 21.46°C/W (Unducted) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Type** | Push-Pin | | **Dimensions (L x W x H)** | 54mm x 45mm x 15mm | | **Fin Style** | Fine Pitch (Cross-Cut) | --- ### Key Electronic Components & Features The "ATS-07H-32-C2-R0" is not a powered electronic circuit itself, but a passive cooling assembly consisting of several critical parts: #### 1. The Heat Sink Body Constructed from aluminum for high thermal conductivity. It utilizes a **cross-cut fin design**, which increases the surface area for heat exchange with the surrounding air while maintaining a low profile (15mm height). #### 2. The Push-Pin Mechanism Instead of screws or adhesive, this model uses a brass push-pin with a stainless steel spring. - **Benefit:** Provides consistent pressure on the electronic chip, ensuring optimal thermal contact. - **Part Material:** Plastic or brass pins with steel springs. #### 3. Thermal Interface Material (TIM) The "R0" at the end of the part number typically indicates the presence of a pre-applied **Thermal Interface Material**. - **Function:** Fills microscopic air gaps between the heat sink and the electronic component to maximize heat transfer. #### 4. Blue Anodized Coating The blue finish is not just aesthetic. Anodization increases surface emissivity and provides a layer of electrical insulation and corrosion resistance. --- ### Application in Electronics This part is commonly found in: * **Networking Gear:** Cooling high-speed ASICs in switches and routers. * **Embedded Systems:** Industrial PCs where vertical space is limited. * **Power Supplies:** Heat dissipation for MOSFETs or voltage regulators.