The **ATS-07H-34-C2-R0** is not a semiconductor or an active electronic component; it is a **high-performance heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **push-pin** attachment series, specifically designed for cooling electronic components like CPUs, GPUs, or high-power chipsets on Printed Circuit Boards (PCBs). --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 35.0mm x 35.0mm x 25.0mm | | **Fin Type** | Fine Pitch (straight fins) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 6.73°C/W (at 100 LFM) | | **Thermal Interface** | T766 (Pre-applied Thermal Grease) | --- ## 2. Component Design & Mechanics ### Physical Construction The "34" in the part number indicates the specific fin geometry. The heat sink is made of **extruded aluminum**, which provides a high surface-area-to-volume ratio. The **blue anodized finish** is not just for aesthetics; it increases the emissivity of the surface, slightly improving radiative cooling. ### Mounting Mechanism * **Push-Pin System:** It uses a spring-loaded push-pin mechanism. This ensures consistent pressure (clamping force) on the electronic chip, which is critical for maximizing the efficiency of the thermal interface material (TIM). * **Pre-applied TIM:** It comes with **T766 thermal grease** pre-applied to the base, ensuring a low-resistance thermal path between the chip and the aluminum. --- ## 3. Thermal Performance Profile The effectiveness of this part depends heavily on the airflow (Linear Feet per Minute) within the electronic enclosure: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low) | 6.73 | | 200 (Medium) | 4.12 | | 300 (High) | 3.23 | | 400 (Very High) | 2.78 | --- ## 4. Typical Applications This component is used to manage heat in the following electronic environments: * **Networking Gear:** Switches, routers, and hubs. * **Industrial PCs:** Cooling embedded processors. * **Power Supplies:** Heat dissipation for MOSFETs or bridge rectifiers. * **FPGA Cooling:** Thermal management for programmable logic devices. ---