ATS-07H-39-C2-R0
AI

The **ATS-07H-39-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from integrated circuits (ICs), CPUs, or other surface-mount components.
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## 1. Technical Specifications
The following table highlights the core physical and thermal properties of the component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic/Brass) |
| **Thermal Resistance** | 18.94°C/W (Unducted @ 100 LFM) |
| **Dimensions (L x W x H)** | 45mm x 45mm x 10mm |
| **Base Shape** | Square |
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## 2. Key Design Features
### A. Material and Coating
* **Aluminum Construction:** Provides a lightweight solution with high thermal conductivity.
* **Blue Anodized Finish:** Not only provides a professional look but also offers a slight increase in surface area emissivity and protects the aluminum from corrosion.
### B. pushPIN™ Attachment System
This specific model uses the **pushPIN™** system, which features:
* A pre-drilled hole pattern for easy installation.
* A compression spring to provide precise pressure for maximum thermal interface material (TIM) performance.
* Reliable mechanical attachment that prevents the heat sink from shifting during vibration or shipping.
### C. Fin Geometry
The "39" series generally indicates a **Fine-Pitch** fin design. This maximizes surface area in a low-profile (10mm height) footprint, making it ideal for tight enclosures or dense PCB layouts where vertical space is limited.
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## 3. Thermal Performance Metrics
Thermal resistance indicates how efficiently the heat sink moves heat away from the component.
* **100 LFM (0.5 m/s):** 18.94 °C/W
* **300 LFM (1.5 m/s):** 6.75 °C/W
* **500 LFM (2.5 m/s):** 4.69 °C/W
*Note: Performance improves significantly as airflow (LFM - Linear Feet per Minute) increases.*
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## 4. Part Number Breakdown
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Advanced Thermal Solutions (Manufacturer) |
| **07** | Series/Internal Code |
| **H** | High Performance / Heat Sink Height Code |
| **39** | Dimension/Design Family |
| **C2** | Thermal Interface Material (T766 / Pre-applied Phase Change) |
| **R0** | RoHS Compliant / Revision code |
- ⤷
What is the hole pattern spacing for the push-pin mounting on this heat sink?
- ⤷ Is this heat sink suitable for a component with a TDP higher than 50W?
- ⤷ What type of Thermal Interface Material (TIM) comes pre-applied on the C2 variant?