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  • ATS-07H-39-C2-R0

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    The **ATS-07H-39-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from integrated circuits (ICs), CPUs, or other surface-mount components. --- ## 1. Technical Specifications The following table highlights the core physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 18.94°C/W (Unducted @ 100 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Base Shape** | Square | --- ## 2. Key Design Features ### A. Material and Coating * **Aluminum Construction:** Provides a lightweight solution with high thermal conductivity. * **Blue Anodized Finish:** Not only provides a professional look but also offers a slight increase in surface area emissivity and protects the aluminum from corrosion. ### B. pushPIN™ Attachment System This specific model uses the **pushPIN™** system, which features: * A pre-drilled hole pattern for easy installation. * A compression spring to provide precise pressure for maximum thermal interface material (TIM) performance. * Reliable mechanical attachment that prevents the heat sink from shifting during vibration or shipping. ### C. Fin Geometry The "39" series generally indicates a **Fine-Pitch** fin design. This maximizes surface area in a low-profile (10mm height) footprint, making it ideal for tight enclosures or dense PCB layouts where vertical space is limited. --- ## 3. Thermal Performance Metrics Thermal resistance indicates how efficiently the heat sink moves heat away from the component. * **100 LFM (0.5 m/s):** 18.94 °C/W * **300 LFM (1.5 m/s):** 6.75 °C/W * **500 LFM (2.5 m/s):** 4.69 °C/W *Note: Performance improves significantly as airflow (LFM - Linear Feet per Minute) increases.* --- ## 4. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **07** | Series/Internal Code | | **H** | High Performance / Heat Sink Height Code | | **39** | Dimension/Design Family | | **C2** | Thermal Interface Material (T766 / Pre-applied Phase Change) | | **R0** | RoHS Compliant / Revision code |
    ✨ Follow-up Questions
    • ⤷ What is the hole pattern spacing for the push-pin mounting on this heat sink?
    • ⤷ Is this heat sink suitable for a component with a TDP higher than 50W?
    • ⤷ What type of Thermal Interface Material (TIM) comes pre-applied on the C2 variant?