The **ATS-07H-41-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series and is designed for cooling electronic components like CPUs, GPUs, and power transistors. ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 17.78mm | | **Mounting Type** | pushPIN™ (Spring Loaded) | | **Pitch (Hole Spacing)** | 3.5mm | | **Thermal Resistance** | 10.07 °C/W (at 100 LFM) | | **Attachment Method** | Push-pin with Brass Spring | --- ### 2. Key Features and Components * **Cross-Cut Fin Design:** The "C3" designation often refers to a specific fin density and arrangement. The cross-cut pattern allows for omnidirectional airflow, making it efficient regardless of the direction the cooling fan is blowing. * **pushPIN™ Attachment:** Unlike adhesive tapes, this uses a physical pin and spring mechanism. This provides high pressure for better thermal contact and is more reliable in high-vibration environments. * **High-Performance Thermal Interface Material (TIM):** Typically, these come pre-applied with a thermal pad or paste to ensure immediate conductivity between the electronic chip and the aluminum base. * **Blue Anodized Coating:** The surface treatment is not just aesthetic; it increases surface emissivity and provides corrosion resistance. --- ### 3. Applications in Electronics This specific heatsink is utilized in various electronic assemblies where space is limited but heat dissipation is critical: 1. **Embedded Systems:** Industrial PCs and controllers. 2. **Networking Hardware:** Routers, switches, and high-speed modems. 3. **Power Electronics:** Voltage regulators and power supplies that generate significant localized heat. 4. **Telecommunications:** Transceivers and signal processing units. --- ### 4. Comparison of Airflow Performance Thermal resistance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **Resistance (°C/W)** | 10.07 | 3.43 | 2.03 | 1.50 | 1.25 |