ATS-07H-52-C3-R0
AI

The **ATS-07H-52-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS).
Below is a detailed breakdown of its electronic and physical specifications.
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### 1. Technical Specifications
This part is designed for cooling electronic components like CPUs, GPUs, or high-power transistors.
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 10.88°C/W (Natural Convection) |
| **Attachment Method** | pushPIN™ |
| **Dimensions (L x W x H)** | 35mm x 35mm x 25mm |
| **Weight** | 100 grams (approx.) |
| **Compliance** | RoHS Compliant |
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### 2. Key Design Features
The "ATS-07H-52-C3-R0" belongs to the **pushPIN™** series, which is characterized by the following:
* **Fin Style (Fine Pitch):** It uses a high-density fin pattern to maximize surface area, allowing for better heat dissipation in forced-air environments.
* **pushPIN™ Attachment:** Instead of messy adhesives or thermal tape, this part uses a spring-loaded pin mechanism. This ensures constant pressure (load) on the electronic chip, which optimizes the thermal interface.
* **Pre-assembled Thermal Interface Material (TIM):** It typically comes with a high-performance thermal pad or phase-change material applied to the base to bridge the air gap between the component and the heat sink.
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### 3. Thermal Performance (Airflow Data)
The effectiveness of this heat sink depends on the airflow speed (measured in Feet Per Minute - LFM).
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| **100** | 10.88 |
| **300** | 4.06 |
| **500** | 2.87 |
| **700** | 2.42 |
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### 4. Part Number Breakdown
Understanding the nomenclature helps in identifying the specific variant:
* **ATS:** Advanced Thermal Solutions (Manufacturer)
* **07H:** Series/Fin type designation
* **52:** Dimensional configuration code
* **C3:** Material/Finish code (Blue Anodized)
* **R0:** Revision/Packaging code
- ⤷
What is the hole-to-hole spacing required on the PCB for this heat sink?
- ⤷ How does blue anodization affect the thermal performance compared to black anodization?
- ⤷ Are there specific pushPIN spring types available for different PCB thicknesses?