The **ATS-07H-62-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 16.48°C/W (at 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### Key Design Elements #### 1. Material and Coating The heatsink is made of **Aluminum 6063**, which offers a balance between thermal conductivity, weight, and cost. The **Blue Anodized** finish is not just aesthetic; it provides: * Increased corrosion resistance. * Improved surface emissivity (helping with radiation heat transfer). * Electrical insulation to prevent shorts if a tool touches the surface. #### 2. The pushPIN™ Attachment System This part uses a specific mounting mechanism known as **pushPIN™**. It includes: * **Compression Springs:** These ensure "Precise Force Control," meaning the heatsink is pressed against the chip with the exact pressure required for optimal heat transfer without cracking the silicon die. * **Plastic/Brass Pins:** These lock into pre-drilled holes on the PCB, making installation fast and tool-free. #### 3. Thermal Interface Material (TIM) The base comes pre-applied with **T766**. This is a high-performance phase-change material or thermal grease that fills the microscopic air gaps between the component surface and the heatsink base, significantly reducing thermal contact resistance. --- ### Thermal Performance Curve Thermal resistance decreases as airflow (measured in Linear Feet per Minute - LFM) increases: | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 16.48 | | 300 | 1.5 | 6.67 | | 500 | 2.5 | 4.48 | | 700 | 3.5 | 3.66 | --- ### Common Applications * **BGA (Ball Grid Array) Cooling:** Used for mid-range processors and FPGAs. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **Telecommunications:** Cooling chips in routers and high-speed switches.