The **ATS-07H-66-C2-R0** is a specific electronic cooling component known as a **Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) and belongs to their "push-pin" series designed for high-performance cooling of integrated circuits (ICs). --- ### 1. Technical Specifications Below is a breakdown of the physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 45mm x 45mm x 25mm | | **Fin Style** | Straight Fin | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 11.91°C/W (at 100 LFM) | | **RoHS Status** | Compliant | --- ### 2. Key Components and Design Features #### A. The Heat Sink Body * **Material:** Made of high-grade aluminum, which offers a balance between thermal conductivity and lightweight properties. * **Fin Profile:** Features vertical fins that increase the surface area available for heat dissipation. The "66" in the part number indicates the specific fin density and geometry. * **Finish:** Blue anodized finish provides corrosion resistance and slightly improves radiative cooling. #### B. The Attachment (Push-Pin) Unlike adhesive-based heat sinks, this model uses a **spring-loaded push-pin system**: * **Stability:** Provides consistent pressure on the processor, ensuring a tight thermal interface. * **Reliability:** Mechanical fastening is more durable than thermal tape in high-vibration environments. * **Pre-drilled Holes:** Requires the PCB to have specific mounting holes drilled to accommodate the pins. #### C. Thermal Interface Material (TIM) * The part usually comes with **pre-applied phase-change material** or a thermal pad on the base. This fills the microscopic air gaps between the heat sink and the chip (CPU/GPU/FPGA) to ensure efficient heat transfer. --- ### 3. Common Applications This part is typically used for cooling mid-range heat-generating components such as: * **FPGAs & ASICs:** Used in telecommunications and networking gear. * **Embedded Processors:** Found in industrial computers. * **Power Supplies:** Cooling voltage regulators or power transistors. --- ### 4. Thermal Performance Summary Thermal resistance indicates how effectively the part moves heat away from the component. | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 11.91 | | 300 | 1.5 | 3.33 | | 500 | 2.5 | 2.15 | *[LFM = Linear Feet per Minute]*