The part number **ATS-07H-72-C3-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" series designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The table below summarizes the physical and thermal characteristics of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 35mm | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 5.19°C/W (at 1.0 m/s flow) | | **Fin Style** | Straight (High-density) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The part number follows a specific naming convention used by ATS to identify the component's features: - **ATS-07H**: Refers to the series and specific push-pin mounting style. - **72**: Represents the specific height and fin configuration (35mm height). - **C3**: Indicates the Thermal Interface Material (T766) and the specific thermal performance grade. - **R0**: Refers to the revision code or specific packaging/compliance standard (RoHS compliant). --- ### 3. Key Electronic Functions While the heat sink itself is not an active electronic circuit, it is critical for the reliable operation of electronic systems: 1. **Thermal Management**: Its primary role is to dissipate heat generated by semiconductors into the surrounding air to prevent thermal throttling or hardware failure. 2. **Mounting Stability**: The use of a **Push-Pin** mechanism ensures consistent pressure against the chip, which optimizes the contact with the Thermal Interface Material (TIM). 3. **EMI Shielding**: To a minor degree, grounded aluminum heat sinks can assist in reducing electromagnetic interference (EMI) radiating from high-speed processors. --- ### 4. Typical Applications * **Computer Networking**: Cooling routers, switches, and modems. * **Industrial Controls**: Thermal management for PLC processors. * **Consumer Electronics**: High-end gaming consoles or media servers. * **Power Supplies**: Dissipating heat from MOSFETs and voltage regulators.