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  • ATS-07H-76-C3-R0

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    The **ATS-07H-76-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ## 🛠 Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W)** | 25mm x 25mm | | **Height** | 15mm | | **Fin Style** | Straight (Cross-cut) | | **Thermal Resistance** | 11.84°C/W (@ 100 LFM) | | **Pressure Drop** | 0.22 (in-H2O) | --- ## 🧩 Key Electronic Design Features ### 1. Push-Pin Mounting System This part utilizes a **push-pin and spring assembly**. In PCB design, this requires pre-drilled holes in the board. The springs provide "firm attachment" and consistent pressure on the electronic chip, which improves thermal transfer and protects the component during vibration. ### 2. Material & Finish * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Coating:** This is not just for aesthetics; the anodized layer provides electrical insulation and increases "surface emissivity," which slightly improves radiant heat transfer. ### 3. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the part comes with **T766 Phase Change Material** or a similar pre-applied thermal pad. This fills the microscopic air gaps between the electronic component's surface and the heat sink base. --- ## 📈 Performance vs. Airflow Thermal resistance varies based on the Linear Feet per Minute (LFM) of airflow provided by system fans: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 11.84 | | 300 (1.5 m/s) | 5.38 | | 500 (2.5 m/s) | 4.15 | | 700 (3.5 m/s) | 3.55 | --- ## ⚠️ Implementation Notes * **Pitch:** Ensure your PCB layout matches the hole-to-hole pitch of the push-pins (typically 20mm to 30mm depending on the specific bracket). * **Height Clearance:** At 15mm tall, ensure it does not interfere with daughter cards or chassis covers.
    ✨ Follow-up Questions
    • ⤷ What is the hole pitch required for mounting this heat sink on a PCB?
    • ⤷ How does the T766 phase change material compare to standard thermal grease?
    • ⤷ Are there alternative mounting options if my PCB lacks push-pin holes?