ATS-07H-76-C3-R0
AI

The **ATS-07H-76-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs.
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## 🛠 Technical Specifications
Below are the primary physical and thermal characteristics of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Dimensions (L x W)** | 25mm x 25mm |
| **Height** | 15mm |
| **Fin Style** | Straight (Cross-cut) |
| **Thermal Resistance** | 11.84°C/W (@ 100 LFM) |
| **Pressure Drop** | 0.22 (in-H2O) |
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## 🧩 Key Electronic Design Features
### 1. Push-Pin Mounting System
This part utilizes a **push-pin and spring assembly**. In PCB design, this requires pre-drilled holes in the board. The springs provide "firm attachment" and consistent pressure on the electronic chip, which improves thermal transfer and protects the component during vibration.
### 2. Material & Finish
* **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties.
* **Blue Anodized Coating:** This is not just for aesthetics; the anodized layer provides electrical insulation and increases "surface emissivity," which slightly improves radiant heat transfer.
### 3. Thermal Interface Material (TIM)
The "R0" suffix typically indicates that the part comes with **T766 Phase Change Material** or a similar pre-applied thermal pad. This fills the microscopic air gaps between the electronic component's surface and the heat sink base.
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## 📈 Performance vs. Airflow
Thermal resistance varies based on the Linear Feet per Minute (LFM) of airflow provided by system fans:
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 11.84 |
| 300 (1.5 m/s) | 5.38 |
| 500 (2.5 m/s) | 4.15 |
| 700 (3.5 m/s) | 3.55 |
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## ⚠️ Implementation Notes
* **Pitch:** Ensure your PCB layout matches the hole-to-hole pitch of the push-pins (typically 20mm to 30mm depending on the specific bracket).
* **Height Clearance:** At 15mm tall, ensure it does not interfere with daughter cards or chassis covers.
- ⤷
What is the hole pitch required for mounting this heat sink on a PCB?
- ⤷ How does the T766 phase change material compare to standard thermal grease?
- ⤷ Are there alternative mounting options if my PCB lacks push-pin holes?