The part number **ATS-07H-82-C2-R0** refers to a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. Specifically, it belongs to the **maxiFLOW™** series, designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications This component is an "active-ready" passive cooling device. Below are its primary physical and thermal characteristics: | Property | Value / Description | | :--- | :--- | | **Material** | Aluminum (Extruded) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 24.89mm | | **Thermal Resistance** | 1.57°C/W (at 200 LFM) | | **Pressure Drop** | 0.15 (at 200 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **07H**: Series/Profile code. * **82**: Specific footprint/design ID. * **C2**: Material and Finish code (C2 usually denotes Blue Anodized Aluminum). * **R0**: Revision or specific packaging version. --- ### 3. Key Electronic Cooling Features #### A. The maxiFLOW™ Design The heat sink features a **flared fin structure**. Unlike traditional straight-fin heat sinks, the fins spread outward. This design increases the surface area and creates more turbulence in the airflow, which significantly enhances the cooling efficiency in constrained spaces. #### B. pushPIN™ Attachment This part utilizes the **pushPIN™ attachment mechanism**. Instead of using messy adhesives or simple clips, it uses a set of spring-loaded plastic or brass pins. * **Uniform Pressure:** Ensures the heat sink is pressed evenly against the electronic chip. * **Stability:** Prevents the heat sink from shifting during vibration or shipping. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a phase-change or high-performance thermal grease that fills the microscopic air gaps between the chip and the aluminum base, ensuring maximum heat transfer. --- ### 4. Ideal Applications * **Telecommunications:** High-speed routers and switches. * **Embedded Systems:** Industrial PCs and controllers. * **Power Electronics:** Cooling MOSFETs or Voltage Regulators.