The **ATS-07H-91-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 10.00mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 22.01°C/W (at 100 LFM) | | **Pressure Spring** | Stainless Steel (R0 suffix) | --- ### 2. Key Electronic Features The "electronic" relevance of this part lies in its integration into PCB (Printed Circuit Board) designs: * **Thermal Management:** It is passive cooling hardware. Its primary role is to increase the surface area of a heat-generating chip, allowing ambient air to carry heat away more efficiently. * **pushPIN™ Design:** This system uses a flexible, spring-loaded mechanism. This ensures even pressure across the electronic chip (TIM - Thermal Interface Material), which is critical for maximizing heat transfer and preventing "hot spots." * **Low Profile:** With a height of only 10mm, it is designed for electronics with tight vertical clearances, such as 1U servers, thin clients, or embedded systems. --- ### 3. Nomenclature Breakdown Understanding the part number helps in identifying the specific configuration: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **07H** | Series identification | | **91** | Specific footprint/dimension code | | **C3** | Thermal Interface Material (TIM) type / Performance level | | **R0** | Finish/Attachment detail (usually Blue Anodized / Standard Spring) | --- ### 4. Implementation Example To integrate this into an electronic design, you would typically follow this workflow: ```markdown 1. Identify the chip TDP (Thermal Design Power). 2. Calculate the required °C/W (Thermal Resistance) based on ambient air. 3. Drill two holes in the PCB at the specified pitch (distance). 4. Apply Thermal Paste or a Phase Change Material to the chip. 5. Snap the ATS-07H-91-C3-R0 push-pins into the PCB holes. ```