The **ATS-07H-93-C2-R0** is a specific electronic cooling component known as a **Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) and belongs to the *pushPIN™* series. Below is a breakdown of its technical specifications and electronic physical properties. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Product Type** | Heat Sink | | **Series** | pushPIN™ | | **Attachment Type** | Push-pin (Spring-loaded) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 7.37 °C/W (at 100 LFM) | | **Flow Orientation** | Vertical (Straight Fin) | --- ### 2. Physical Dimensions Precision is critical for this component as it must align with pre-drilled holes on a Printed Circuit Board (PCB). * **Length (Dimension A):** 40.00 mm * **Width (Dimension B):** 40.00 mm * **Height (Dimension C):** 20.00 mm * **Pitch (Dimension E):** 33.00 mm (Distance between pins) * **Pitch (Dimension F):** 33.00 mm --- ### 3. Key Electronic Cooling Concepts #### A. Thermal Performance The efficiency of the ATS-07H-93-C2-R0 is measured by its thermal resistance. At a standard airflow of 100 LFM (Linear Feet per Minute), the resistance is **7.37 °C/W**. This means for every watt of heat the electronic chip generates, the chip's temperature will rise 7.37 degrees Celsius above the ambient air temperature. #### B. Attachment Mechanism Instead of using messy thermal glues or permanent epoxies, this part uses a **Push-Pin** system: * **Hardware:** Brass or Plastic pins with stainless steel springs. * **Ease of Maintenance:** Allows the heat sink to be removed and re-applied for chip testing or repair. * **Pressure:** The spring ensures a high-pressure contact between the heat sink base and the electronic component (CPU, GPU, or FPGA), maximizing heat transfer. #### C. Thermal Interface Material (TIM) The "R0" at the end of the part number indicates the specific package type. Typically, these units come with a **pre-applied Thermal Interface Material** (usually a phase-change material or high-performance pad) on the base to fill microscopic air gaps between the heat sink and the component. --- ### 4. Implementation Code Example In thermal simulation software (like CFD tools), you might define the heat sink parameters as follows: ```json { "part_number": "ATS-07H-93-C2-R0", "material": "AL6063", "dimensions": { "length": 40, "width": 40, "height": 20 }, "thermal_conductivity": 209, "unit": "mm" } ``` ---