The part number **ATS-07H-98-C2-R0** refers to a high-performance **Heatsink** manufactured by *Advanced Thermal Solutions (ATS)*. It is specifically designed for cooling electronic components such as CPUs, GPUs, or high-power semiconductors. ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 15.31°C/W (at 100 LFM) | | **Attachment Method** | Push-Pin | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 15.00mm | | **Pitch** | Fine Pitch | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the product's features: - **ATS-07**: Series identifier. - **H**: Indicates a "High Profile" or specific fin geometry. - **98**: Designates the specific dimensions and fin pattern (Cross-cut). - **C2**: Refers to the thermal interface material (TIM) or specific coating/performance tier. - **R0**: Indicates the revision level and that the product is RoHS compliant. --- ### 3. Key Electronic Functions While the heatsink itself is a passive mechanical part, its role in an electronic system is critical for: 1. **Heat Dissipation:** It increases the surface area of the heat-generating component (e.g., a MOSFET or Processor), allowing air to carry away heat more efficiently. 2. **Thermal Protection:** By maintaining the junction temperature ($T_j$) within safe limits, it prevents **thermal throttling** or permanent damage to the silicon. 3. **Mechanical Stability:** The "Push-Pin" attachment system uses a brass component and a compression spring to ensure even pressure across the chip surface, which is vital for effective heat transfer. --- ### 4. Airflow Performance Table Thermal resistance changes based on the velocity of the air (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | 600 | 700 | | :--- | :--- | :--- | :--- | :--- | :--- | :--- | :--- | | **Unducted Flow (°C/W)** | 15.31 | 5.81 | 3.19 | 2.20 | 1.72 | 1.44 | 1.27 | | **Ducted Flow (°C/W)** | 2.02 | 1.20 | 0.94 | 0.81 | 0.73 | 0.67 | 0.63 |