ATS-08A-16-C2-R0
AI

The **ATS-08A-16-C2-R0** is a high-performance thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. Unlike active electronic components (like transistors), this is a passive mechanical part used to cool electronic devices.
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### 1. Technical Specifications
This part belongs to the **pushPIN™** Heat Sink Assembly series. Below are the primary specifications:
| Feature | Specification |
| :--- | :--- |
| **Heat Sink Type** | Push-Pin Heat Sink |
| **Material** | Aluminum (AL6063) |
| **Attachment Method** | Push-Pin (Plastic) |
| **Fin Style** | Straight |
| **Fin Type** | Fine Pitch |
| **Thermal Resistance** | 18.08 °C/W (at 100 LFM) |
| **Finish** | Blue Anodized |
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### 2. Dimensions & Physical Characteristics
Precise measurements are critical for PCB layout and ensuring clearance from surrounding electronic components.
* **Width/Length:** 40.00 mm x 40.00 mm
* **Height:** 10.00 mm (Low profile)
* **Pin-to-Pin Distance:** 45.00 mm
* **Weight:** ~15 grams
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### 3. Key Electronic Cooling Features
#### A. Thermal Performance
The efficiency of this part is measured by its ability to dissipate heat (Thermal Resistance). As airflow (LFM - Linear Feet per Minute) increases, the resistance drops:
* **@100 LFM:** 18.08 °C/W
* **@700 LFM:** 2.10 °C/W
#### B. The Push-Pin Mechanism
The "C2" in the part number refers to the specific attachment kit. It uses a **brass or plastic push-pin** with a compression spring. This ensures:
1. **Constant Pressure:** Uniform contact between the heat sink and the chip (e.g., BGA, FPGA).
2. **Safety:** Prevents damage to the silicon die by limiting over-tightening.
#### C. Thermal Interface Material (TIM)
The **"R0"** suffix typically indicates that the part comes with a pre-applied **Phase Change Material** or high-performance thermal pad. This fills the microscopic air gaps between the component and the heat sink to maximize heat transfer.
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### 4. Part Number Breakdown
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Advanced Thermal Solutions |
| **08** | Series Identifier |
| **A** | Aluminum Material |
| **16** | Specific Design/Dimensions |
| **C2** | Thermal Performance Class / Mounting Kit |
| **R0** | Finish and Interface Material Type |
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- ⤷
What are the recommended PCB hole sizes for the push-pin mounting?
- ⤷ Does this heat sink require a specific thermal grease if the R0 pad is removed?
- ⤷ How does the 'Fine Pitch' fin design compare to 'Cross-Cut' designs for airflow?