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  • ATS-08A-16-C2-R0

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    The **ATS-08A-16-C2-R0** is a high-performance thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. Unlike active electronic components (like transistors), this is a passive mechanical part used to cool electronic devices. --- ### 1. Technical Specifications This part belongs to the **pushPIN™** Heat Sink Assembly series. Below are the primary specifications: | Feature | Specification | | :--- | :--- | | **Heat Sink Type** | Push-Pin Heat Sink | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push-Pin (Plastic) | | **Fin Style** | Straight | | **Fin Type** | Fine Pitch | | **Thermal Resistance** | 18.08 °C/W (at 100 LFM) | | **Finish** | Blue Anodized | --- ### 2. Dimensions & Physical Characteristics Precise measurements are critical for PCB layout and ensuring clearance from surrounding electronic components. * **Width/Length:** 40.00 mm x 40.00 mm * **Height:** 10.00 mm (Low profile) * **Pin-to-Pin Distance:** 45.00 mm * **Weight:** ~15 grams --- ### 3. Key Electronic Cooling Features #### A. Thermal Performance The efficiency of this part is measured by its ability to dissipate heat (Thermal Resistance). As airflow (LFM - Linear Feet per Minute) increases, the resistance drops: * **@100 LFM:** 18.08 °C/W * **@700 LFM:** 2.10 °C/W #### B. The Push-Pin Mechanism The "C2" in the part number refers to the specific attachment kit. It uses a **brass or plastic push-pin** with a compression spring. This ensures: 1. **Constant Pressure:** Uniform contact between the heat sink and the chip (e.g., BGA, FPGA). 2. **Safety:** Prevents damage to the silicon die by limiting over-tightening. #### C. Thermal Interface Material (TIM) The **"R0"** suffix typically indicates that the part comes with a pre-applied **Phase Change Material** or high-performance thermal pad. This fills the microscopic air gaps between the component and the heat sink to maximize heat transfer. --- ### 4. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions | | **08** | Series Identifier | | **A** | Aluminum Material | | **16** | Specific Design/Dimensions | | **C2** | Thermal Performance Class / Mounting Kit | | **R0** | Finish and Interface Material Type | ---
    ✨ Follow-up Questions
    • ⤷ What are the recommended PCB hole sizes for the push-pin mounting?
    • ⤷ Does this heat sink require a specific thermal grease if the R0 pad is removed?
    • ⤷ How does the 'Fine Pitch' fin design compare to 'Cross-Cut' designs for airflow?