The **ATS-08A-161-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized Finish) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 4.74°C/W (@ 100 LFM) | | **Weight** | ~42 grams | --- ### 2. Key Design Elements * **pushPIN™ Attachment:** This model uses a spring-loaded "pushPIN" mechanism. This ensures consistent pressure across the interface between the chip and the heat sink, optimizing thermal transfer compared to standard adhesive tapes. * **Fin Density:** The straight-fin design is optimized for environments with forced air (fans). The spacing is engineered to minimize pressure drop while maximizing surface area. * **Material Choice:** It is made of Aluminum 6063, which offers high thermal conductivity while remaining lightweight. The blue anodized coating protects against corrosion and increases surface emissivity. * **Pre-applied TIM:** These units often come with a pre-applied Thermal Interface Material (TIM) on the base to simplify the assembly process. --- ### 3. Application Use Cases This specific heat sink is typically used in industrial and high-computing environments: 1. **Networking Hardware:** Cooling ASICs in switches and routers. 2. **Power Electronics:** Dissipating heat from MOSFETs or IGBTs in power supplies. 3. **Embedded Systems:** Used on motherboards for industrial computers where space is limited but thermal loads are high. --- ### 4. Thermal Performance Data *Measured in °C/W (Thermal Resistance)* | Airflow (LFM) | 100 | 300 | 500 | 700 | | :--- | :--- | :--- | :--- | :--- | | **Unducted Flow** | 4.74 | 2.57 | 2.02 | 1.74 | | **Ducted Flow** | 2.02 | 1.51 | 1.32 | 1.19 |