The **ATS-08A-166-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **maxiFLOW™** series, designed to provide efficient cooling for electronic components such as CPUs, GPUs, and power modules. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 12.30°C/W (at 100 LFM) | | **Attachment Method** | pushPIN™ | | **Fin Style** | Straight (maxiFLOW™) | | **Dimensions (L x W)** | 25mm x 25mm | | **Height** | 10mm | --- ### 2. Key Design Features * **maxiFLOW™ Geometry:** The heat sink features a unique flared fin design that increases the surface area for heat dissipation while maximizing airflow through the fin field. * **pushPIN™ Attachment:** This model uses the proprietary pushPIN™ system, which includes a pre-assembled brass spring and plastic pin. This ensures a consistent pressure (7.5 - 9.5 PSI) on the electronic component for optimal thermal contact. * **Thermal Interface Material (TIM):** It typically comes pre-applied with **T412** thermal tape or grease, which fills microscopic air gaps between the component and the heat sink. * **Blue Anodized Finish:** This is not just aesthetic; the anodization protects the aluminum from corrosion and slightly improves thermal emissivity. --- ### 3. Thermal Performance Analysis The efficiency of the heat sink depends on the airflow (measured in Linear Feet per Minute - LFM). | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 12.30 | | 200 | 9.20 | | 300 | 7.70 | | 400 | 6.80 | --- ### 4. Application Logic This component is used in electronic design to prevent **thermal throttling** or hardware failure. Engineers select this part when: 1. The PCB space is limited (25x25mm footprint). 2. The vertical clearance is low (10mm height). 3. The heat load of the chip is moderate (e.g., small FPGAs or ASICs).