ATS-08A-178-C2-R0
AI

The **ATS-08A-178-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** family, designed to provide efficient cooling for electronic components like CPUs, GPUs, and other integrated circuits.
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### 1. Technical Specifications
The following table summarizes the physical and thermal properties of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Type** | pushPIN™ (Spring-loaded) |
| **Heat Sink Type** | Straight Fin |
| **Dimensions (L x W)** | 35.00 mm x 35.00 mm |
| **Height** | 15.00 mm |
| **Pitch (Mounting)** | 40.00 mm |
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### 2. Electronic Component Breakdown
#### A. Thermal Performance
This heat sink is engineered to dissipate heat from surface-mount components. Thermal resistance is measured in °C/W (Degrees Celsius per Watt).
* **Low Airflow:** High thermal resistance (approx. 4.82 °C/W at 100 LFM).
* **High Airflow:** Lower thermal resistance (approx. 1.70 °C/W at 700 LFM).
#### B. The pushPIN™ Mechanism
Unlike adhesive-based heat sinks, the ATS-08A-178-C2-R0 uses a mechanical attachment system.
* **Springs:** Provides consistent pressure (Pre-assembled with a 27-gauge spring).
* **Push Pins:** Made of brass or plastic, these lock into pre-drilled holes on the PCB.
* **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied, which is a high-performance thermal grease used to fill microscopic air gaps between the component and the heat sink.
#### C. Fin Design
The **Straight Fin** geometry is optimized for "open-air" environments where airflow is directed across the length of the fins. The blue anodized finish is not just for aesthetics; it provides protection against corrosion and slightly improves thermal emissivity.
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### 3. Part Number Decoder
Understanding the "ATS-08A-178-C2-R0" nomenclature:
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Advanced Thermal Solutions (Manufacturer) |
| **08** | Product Series |
| **A** | Material (Aluminum) |
| **178** | Specific Geometry/Configuration |
| **C2** | Thermal Interface Material (T766) / Performance level |
| **R0** | Revision code |
- ⤷
What are the PCB hole diameter requirements for the pushPIN system?
- ⤷ How does the T766 thermal interface material compare to standard silicone grease?
- ⤷ Is this heat sink compatible with passive cooling (natural convection)?