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  • ATS-08A-178-C2-R0

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    The **ATS-08A-178-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** family, designed to provide efficient cooling for electronic components like CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Heat Sink Type** | Straight Fin | | **Dimensions (L x W)** | 35.00 mm x 35.00 mm | | **Height** | 15.00 mm | | **Pitch (Mounting)** | 40.00 mm | --- ### 2. Electronic Component Breakdown #### A. Thermal Performance This heat sink is engineered to dissipate heat from surface-mount components. Thermal resistance is measured in °C/W (Degrees Celsius per Watt). * **Low Airflow:** High thermal resistance (approx. 4.82 °C/W at 100 LFM). * **High Airflow:** Lower thermal resistance (approx. 1.70 °C/W at 700 LFM). #### B. The pushPIN™ Mechanism Unlike adhesive-based heat sinks, the ATS-08A-178-C2-R0 uses a mechanical attachment system. * **Springs:** Provides consistent pressure (Pre-assembled with a 27-gauge spring). * **Push Pins:** Made of brass or plastic, these lock into pre-drilled holes on the PCB. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied, which is a high-performance thermal grease used to fill microscopic air gaps between the component and the heat sink. #### C. Fin Design The **Straight Fin** geometry is optimized for "open-air" environments where airflow is directed across the length of the fins. The blue anodized finish is not just for aesthetics; it provides protection against corrosion and slightly improves thermal emissivity. --- ### 3. Part Number Decoder Understanding the "ATS-08A-178-C2-R0" nomenclature: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **08** | Product Series | | **A** | Material (Aluminum) | | **178** | Specific Geometry/Configuration | | **C2** | Thermal Interface Material (T766) / Performance level | | **R0** | Revision code |
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole diameter requirements for the pushPIN system?
    • ⤷ How does the T766 thermal interface material compare to standard silicone grease?
    • ⤷ Is this heat sink compatible with passive cooling (natural convection)?