The **ATS-08A-47-C2-R0** is a specific part number for a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to provide low thermal resistance and high airflow efficiency for cooling electronic components. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 3.58 °C/W @ 200 LFM | | **Dimensions (L x W x H)** | 36.83mm x 53.00mm x 22.86mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Interface Material** | T766 (Thermal Tape) | | **Fin Style** | Straight (maxiFLOW™ design) | --- ### 2. Design and Components This part is not an active electronic circuit but a **passive thermal management component**. Its design includes several key electronic-related features: * **maxiFLOW™ Fin Profile:** The fins are tapered to maximize surface area and improve airflow through the heat sink, which is critical for cooling power-hungry chips like FPGAs, ASICs, or CPUs. * **pushPIN™ Attachment:** It features a spring-loaded mechanism (plastic or brass pins) that provides consistent pressure on the electronic package, ensuring optimal thermal contact and preventing the part from shifting due to vibration. * **Thermal Interface Material (TIM):** Pre-applied **T766 phase-change material** or tape ensures that the microscopic gaps between the chip and the heat sink are filled, reducing the "bottleneck" of heat transfer. --- ### 3. Application Use Cases The ATS-08A-47-C2-R0 is typically used in the following electronic environments: 1. **Telecommunications:** Cooling networking switches and routers. 2. **Computing:** Server motherboards and storage arrays. 3. **Industrial:** High-speed processing units in automated machinery. ---